Invention Grant
- Patent Title: Strain-inducing semiconductor regions
- Patent Title (中): 应变诱导半导体区域
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Application No.: US12898211Application Date: 2010-10-05
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Publication No.: US08421059B2Publication Date: 2013-04-16
- Inventor: Suman Datta , Jack T. Kavalieros , Been-Yih Jin
- Applicant: Suman Datta , Jack T. Kavalieros , Been-Yih Jin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L49/00
- IPC: H01L49/00 ; H01L21/70

Abstract:
A method to form a strain-inducing semiconductor region is described. In one embodiment, formation of a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In another embodiment, a semiconductor region with a crystalline lattice of one or more species of charge-neutral lattice-forming atoms imparts a strain to a crystalline substrate, wherein the lattice constant of the semiconductor region is different from that of the crystalline substrate, and wherein all species of charge-neutral lattice-forming atoms of the semiconductor region are contained in the crystalline substrate.
Public/Granted literature
- US20110017978A1 STRAIN-INDUCING SEMICONDUCTOR REGIONS Public/Granted day:2011-01-27
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