Invention Grant
- Patent Title: Achieving mechanical and thermal stability in a multi-chip package
- Patent Title (中): 在多芯片封装中实现机械和热稳定性
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Application No.: US13419949Application Date: 2012-03-14
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Publication No.: US08421217B2Publication Date: 2013-04-16
- Inventor: Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
- Applicant: Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Matthew C. Zehrer
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/34
Abstract:
A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
Public/Granted literature
- US20120175766A1 SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN A MULTI-CHIP PACKAGE Public/Granted day:2012-07-12
Information query
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