发明授权
- 专利标题: Epitaxial substrate for electronic device and method of producing the same
- 专利标题(中): 电子器件用外延基板及其制造方法
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申请号: US13319910申请日: 2010-05-10
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公开(公告)号: US08426893B2公开(公告)日: 2013-04-23
- 发明人: Tetsuya Ikuta , Jo Shimizu , Tomohiko Shibata , Ryo Sakamoto , Tsuneo Ito
- 申请人: Tetsuya Ikuta , Jo Shimizu , Tomohiko Shibata , Ryo Sakamoto , Tsuneo Ito
- 申请人地址: JP Tokyo
- 专利权人: Dowa Electronics Materials Co., Ltd.
- 当前专利权人: Dowa Electronics Materials Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2009-114860 20090511; JP2010-107821 20100510
- 国际申请: PCT/JP2010/003162 WO 20100510
- 国际公布: WO2010/131451 WO 20101118
- 主分类号: H01L31/00
- IPC分类号: H01L31/00
摘要:
An epitaxial substrate for electronic devices is provided, which can improve vertical breakdown voltage and provides a method of producing the same. The epitaxial substrate includes a conductive SiC single crystal substrate, a buffer as an insulating layer on the SiC single crystal substrate, and a main laminate formed by epitaxially growing a plurality of Group III nitride layers on the buffer. Further, the buffer includes at least an initial growth layer in contact with the SiC single crystal substrate and a superlattice laminate having a superlattice multi-layer structure on the initial growth layer. The initial growth layer is made of a Ba1Alb1Gac1Ind1N material. Furthermore, the superlattice laminate is configured by alternately stacking a first layer made of a Ba2Alb2Gac2Ind2N material and a second layer made of a Ba3Alb3Gac3Ind3N material having a different band gap from the first layer.
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