Invention Grant
- Patent Title: Structures and methods to reduce maximum current density in a solder ball
- Patent Title (中): 降低焊球最大电流密度的结构和方法
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Application No.: US12640752Application Date: 2009-12-17
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Publication No.: US08446006B2Publication Date: 2013-05-21
- Inventor: Raschid J. Bezama , Timothy H. Daubenspeck , Gary LaFontant , Ian D. Melville , Ekta Misra , George J. Scott , Krystyna W. Semkow , Timothy D. Sullivan , Robin A. Susko , Thomas A. Wassick , Xiaojin Wei , Steven L. Wright
- Applicant: Raschid J. Bezama , Timothy H. Daubenspeck , Gary LaFontant , Ian D. Melville , Ekta Misra , George J. Scott , Krystyna W. Semkow , Timothy D. Sullivan , Robin A. Susko , Thomas A. Wassick , Xiaojin Wei , Steven L. Wright
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David Cain
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/3205
Abstract:
Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.
Public/Granted literature
- US20110147922A1 STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDER BALL Public/Granted day:2011-06-23
Information query
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