Invention Grant
US08455889B2 Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
有权
芯片封装，芯片封装，封装模块和包括芯片封装模块的照明装置的引线框架
- Patent Title: Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
- Patent Title (中): 芯片封装，芯片封装，封装模块和包括芯片封装模块的照明装置的引线框架
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Application No.: US13102586Application Date: 2011-05-06
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Publication No.: US08455889B2Publication Date: 2013-06-04
- Inventor: Young-jin Lee , Jeong-wook Lee , Kyung-mi Moon , Young-hee Song , Ill-heung Choi
- Applicant: Young-jin Lee , Jeong-wook Lee , Kyung-mi Moon , Young-hee Song , Ill-heung Choi
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0043171 20100507
- Main IPC: H01L29/18
- IPC: H01L29/18
Abstract:
A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.
Public/Granted literature
Information query
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