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公开(公告)号：US08840265B2
公开(公告)日：2014-09-23
申请号：US13099972
申请日：2011-05-03
申请人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
发明人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
CPC分类号： F21V23/06 , F21K9/275 , F21V29/507 , F21V29/83 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
摘要翻译： 一种照明装置，包括：光源单元，包括至少一个光源模块，所述至少一个光源模块包括多个发光器件芯片和引导框架，所述引线框架安装有所述发光器件芯片，并且连接所安装的发光器件芯片; 扩散盖，其具有容纳光源模块的内部空间和从光源模块发射的光; 以及与扩散罩相邻形成的安装部，以安装光源模块。
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2.发明申请LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION APPARATUS EMPLOYING THE LIGHT EMITTING DEVICE PACKAGE 有权用于发光装置包装的发光框架，发光装置包装件以及使用发光装置包装件的照明装置公开(公告)号：US20110260646A1
公开(公告)日：2011-10-27
申请号：US13092468
申请日：2011-04-22
申请人： Kyung-mi MOON , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
发明人： Kyung-mi MOON , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
CPC分类号： H01L25/075 , H01L25/0753 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2924/12044 , H01L2924/3025 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.
摘要翻译： 用于发光器件封装的引线框架，发光器件封装以及采用发光器件封装的照明设备。 所述引线框架包括多个安装部分，所述多个安装部分安装有多个发光器件芯片; 用于电路连接多个发光器件芯片的多个连接部分; 从所述多个连接部分延伸的端子部分。 发光器件封装通过将多个发光器件芯片直接安装在引线框架上并将安装的发光器件芯片封装在引线框架上而形成。 引线框架包括用于电路连接多个发光器件芯片的多个连接部分和其一部分电路暴露的端子部分。
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公开(公告)号：US08807786B2
公开(公告)日：2014-08-19
申请号：US13099972
申请日：2011-05-03
申请人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
发明人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
摘要： An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
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4.发明授权Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module 有权芯片封装，芯片封装，封装模块和包括芯片封装模块的照明装置的引线框架公开(公告)号：US08455889B2
公开(公告)日：2013-06-04
申请号：US13102586
申请日：2011-05-06
申请人： Young-jin Lee , Jeong-wook Lee , Kyung-mi Moon , Young-hee Song , Ill-heung Choi
发明人： Young-jin Lee , Jeong-wook Lee , Kyung-mi Moon , Young-hee Song , Ill-heung Choi
IPC分类号： H01L29/18
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.
摘要翻译： 一种用于芯片封装的引线框架，芯片封装，封装模块和包括芯片封装模块的照明装置。 芯片封装包括第一耦合部分和第二耦合部分，该第一耦合部分和第二耦合部分在引线框架的边缘处彼此耦合，用于在其上安装芯片，因此封装模块通过将第一耦合部分和第二耦合部分 对彼此。
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5.发明授权Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package 有权用于发光器件封装的引线框架，发光器件封装以及采用发光器件封装的照明设备公开(公告)号：US08638037B2
公开(公告)日：2014-01-28
申请号：US13092468
申请日：2011-04-22
申请人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
发明人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
CPC分类号： H01L25/075 , H01L25/0753 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2924/12044 , H01L2924/3025 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.
摘要翻译： 用于发光器件封装的引线框架，发光器件封装以及采用发光器件封装的照明设备。 所述引线框架包括多个安装部分，所述多个安装部分安装有多个发光器件芯片; 用于电路连接多个发光器件芯片的多个连接部分; 从所述多个连接部分延伸的端子部分。 发光器件封装通过将多个发光器件芯片直接安装在引线框架上并将安装的发光器件芯片封装在引线框架上而形成。 引线框架包括用于电路连接多个发光器件芯片的多个连接部分和其一部分电路暴露的端子部分。
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公开(公告)号：US20110267814A1
公开(公告)日：2011-11-03
申请号：US13099972
申请日：2011-05-03
申请人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Yong-jin Lee
发明人： Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Yong-jin Lee
IPC分类号： F21V11/00
CPC分类号： F21V23/06 , F21K9/275 , F21V29/507 , F21V29/83 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
摘要翻译： 一种照明装置，包括：光源单元，包括至少一个光源模块，所述至少一个光源模块包括多个发光器件芯片和引导框架，所述引线框架安装有所述发光器件芯片，并且连接所安装的发光器件芯片; 扩散盖，其具有容纳光源模块的内部空间和从光源模块发射的光; 以及与扩散罩相邻形成的安装部，以安装光源模块。
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