发明授权
US08470402B2 Method of depositing a metal-containing dielectric film 有权
沉积含金属介电膜的方法

Method of depositing a metal-containing dielectric film
摘要:
Methods of depositing a metal containing dielectric film on a substrate are disclosed. The metal containing dielectric film has the formula (M11-a M2a) Ob Nc, wherein 0≦a
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