发明授权
- 专利标题： Methods and apparatuses to stiffen integrated circuit package
- 专利标题（中）： 强化集成电路封装的方法和装置
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申请号： US13413616申请日： 2012-03-06
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公开(公告)号： US08502400B2公开(公告)日： 2013-08-06
- 发明人: Prasanna Karpur , Sriram Muthukumar
- 申请人： Prasanna Karpur , Sriram Muthukumar
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L23/48
摘要：
A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
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