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公开(公告)号：US20120187583A1
公开(公告)日：2012-07-26
申请号：US13413616
申请日：2012-03-06
申请人： Prasanna Karpur , Sriram Muthukumar
发明人： Prasanna Karpur , Sriram Muthukumar
IPC分类号： H01L23/31
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/15311 , H01L2924/00
摘要： A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
摘要翻译： 提出了一种用于封装衬底的大坝加强件。 在一个实施方案中，坝加强件包括可热固化的聚合物，并且与底部填充材料同时固化以作为基底的加强件。 在另一个实施例中，可以分配可固化储存器材料以填充集成电路管芯和坝加强件之间的空间，形成用作封装衬底的附加加强件的厚的储存层。
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公开(公告)号：US08502400B2
公开(公告)日：2013-08-06
申请号：US13413616
申请日：2012-03-06
申请人： Prasanna Karpur , Sriram Muthukumar
发明人： Prasanna Karpur , Sriram Muthukumar
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/15311 , H01L2924/00
摘要： A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
摘要翻译： 提出了一种用于封装衬底的大坝加强件。 在一个实施方案中，坝加强件包括可热固化的聚合物，并且与底部填充材料同时固化以作为基底的加强件。 在另一个实施例中，可以分配可固化储存器材料以填充集成电路管芯和坝加强件之间的空间，形成用作封装衬底的附加加强件的厚的储存层。
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公开(公告)号：US08143110B2
公开(公告)日：2012-03-27
申请号：US12646363
申请日：2009-12-23
申请人： Prasanna Karpur , Sriram Muthukumar
发明人： Prasanna Karpur , Sriram Muthukumar
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/15311 , H01L2924/00
摘要： A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
摘要翻译： 提出了一种用于封装衬底的大坝加强件。 在一个实施方案中，坝加强件包括可热固化的聚合物，并且与底部填充材料同时固化以作为基底的加强件。 在另一个实施例中，可以分配可固化储存器材料以填充集成电路管芯和坝加强件之间的空间，形成用作封装衬底的附加加强件的厚的储存层。
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公开(公告)号：US20110147912A1
公开(公告)日：2011-06-23
申请号：US12646363
申请日：2009-12-23
申请人： Prasanna Karpur , Sriram Muthukumar
发明人： Prasanna Karpur , Sriram Muthukumar
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/15311 , H01L2924/00
摘要： A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
摘要翻译： 提出了一种用于封装衬底的大坝加强件。 在一个实施方案中，坝加强件包括可热固化的聚合物，并且与底部填充材料同时固化以作为基底的加强件。 在另一个实施例中，可以分配可固化储存器材料以填充集成电路管芯和坝加强件之间的空间，形成用作封装衬底的附加加强件的厚的储存层。
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