Invention Grant
US08512939B2 Photoresist stripping technique 有权
光阻剥离技术

Photoresist stripping technique
Abstract:
A method for fabricating an integrated circuit device is disclosed. The method may include providing a substrate; forming a first material layer over the substrate; forming a patterned second material layer over the substrate; and removing the patterned second material layer with a fluid comprising a steric hindered organic base and organic solvent.
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