Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13328574Application Date: 2011-12-16
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Publication No.: US08513717B2Publication Date: 2013-08-20
- Inventor: Fujio Masuoka , Hiroki Nakamura
- Applicant: Fujio Masuoka , Hiroki Nakamura
- Applicant Address: SG Peninsula Plaza
- Assignee: Unisantis Electronics Singapore Pte. Ltd.
- Current Assignee: Unisantis Electronics Singapore Pte. Ltd.
- Current Assignee Address: SG Peninsula Plaza
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L31/062 ; H01L29/94 ; H01L31/113 ; H01L31/119
![Semiconductor device and method for manufacturing the same](/abs-image/US/2013/08/20/US08513717B2/abs.jpg.150x150.jpg)
Abstract:
A first driver transistor includes a first gate insulating film that surrounds a periphery of a first island-shaped semiconductor, a first gate electrode having a first surface that is in contact with the first gate insulating film, and first and second first-conductivity-type high-concentration semiconductors disposed on the top and bottom of the first island-shaped semiconductor, respectively. A first load transistor includes a second gate insulating film having a first surface that is in contact with a second surface of the first gate electrode, a first arcuate semiconductor formed so as to be in contact with a portion of a second surface of the second gate insulating film, and first and second second-conductivity-type high-concentration semiconductors disposed on the top and bottom of the first arcuate semiconductor, respectively. A first gate line extends from the first gate electrode and is made of the same material as the first gate electrode.
Public/Granted literature
- US20120181618A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-07-19
Information query
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