发明授权
- 专利标题： Shape simulation apparatus, shape simulation program, semiconductor production apparatus, and semiconductor device production method
- 专利标题（中）： 形状模拟装置，形状仿真程序，半导体制造装置和半导体装置制造方法
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申请号： US12858249申请日： 2010-08-17
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公开(公告)号： US08535550B2公开(公告)日： 2013-09-17
- 发明人: Nobuyuki Kuboi , Takashi Kinoshita , Tetsuya Tatsumi
- 申请人： Nobuyuki Kuboi , Takashi Kinoshita , Tetsuya Tatsumi
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： The Chicago Technology Law Group, LLC
- 代理商 Robert J. Depke
- 优先权： JP2009-193334 20090824
- 主分类号： G06F19/00
- IPC分类号： G06F19/00
摘要：
Disclosed herein is a shape simulation apparatus including: a flux computation block configured to compute the flux of particles incident on the surface of a wafer covered with a mask; and a shape computation block configured to compute a surface shape of the wafer by allowing the coordinates of a plurality of calculation points established on the surface of the wafer to be time-evolved based on the incident flux computed.