Invention Grant
- Patent Title: Reflow method
- Patent Title (中): 回流法
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Application No.: US13656290Application Date: 2012-10-19
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Publication No.: US08536045B2Publication Date: 2013-09-17
- Inventor: Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce P.L.C.
- Priority: KR10-2009-0004231 20090119
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.
Public/Granted literature
- US20130068731A1 Reflow Apparatus, Reflow Method, And Package Apparatus Public/Granted day:2013-03-21
Information query
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