公开(公告)号：US11658148B2

公开(公告)日：2023-05-23

申请号：US16854452

申请日：2020-04-21

申请人： Samsung Electronics Co., Ltd.

发明人： Hyuekjae Lee ,  Jihoon Kim ,  JiHwan Suh ,  So Youn Lee ,  Jihwan Hwang ,  Taehun Kim ,  Ji-Seok Hong

IPC分类号： H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18 ,  H01L21/56

CPC分类号： H01L25/0652 ,  H01L21/565 ,  H01L24/08 ,  H01L24/80 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/08146 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2225/06589

摘要： A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material. A top surface of the first semiconductor chip and a top surface of the first molding layer are flat and are coplanar with each other, and a ratio of the difference between the coefficient of thermal expansion between the second molding layer and the first molding layer to the difference between the coefficient of thermal expansion between the second molding layer and the substrate is between 5:1 and 20:1.

公开(公告)号：US08536045B2

公开(公告)日：2013-09-17

申请号：US13656290

申请日：2012-10-19

申请人： Samsung Electronics Co., Ltd.

发明人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

IPC分类号： H01L21/44

CPC分类号： B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

摘要： A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.

摘要翻译： 提供给处理物体的焊球的回流方法可以包括提供线圈，向线圈施加电流，以及通过由线圈包围的内部空间移动处理物体。

公开(公告)号：US10886255B2

公开(公告)日：2021-01-05

申请号：US16532598

申请日：2019-08-06

申请人： Samsung Electronics Co., Ltd.

发明人： Ji-Seok Hong ,  Ji-Hoon Kim ,  Tae-Hun Kim ,  Hyuek-Jae Lee ,  Ji-Hwan Hwang

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48 ,  H01L21/56 ,  H01L21/822

摘要： A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.

公开(公告)号：US20130193588A1

公开(公告)日：2013-08-01

申请号：US13733481

申请日：2013-01-03

申请人： Samsung Electronics Co, Ltd.

发明人： Ji-Seok Hong ,  Kwang-chul Choi ,  Sangwon Kim ,  Hyun-Jung Song ,  Eun-Kyoung Choi

IPC分类号： H01L23/29

CPC分类号： H01L23/29 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/29017 ,  H01L2224/29036 ,  H01L2224/29099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83986 ,  H01L2224/84201 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

摘要翻译： 半导体封装包括通过连接结构电互连的第一和第二半导体元件。 第一和第二半导体元件通过保护结构连接，保护结构包括由保持层包围的粘合剂层。

公开(公告)号：US09159659B2

公开(公告)日：2015-10-13

申请号：US13835969

申请日：2013-03-15

申请人： SAMSUNG Electronics Co., Ltd.

发明人： Sang-Won Kim ,  Kwang-Chul Choi ,  Hyun-Jung Song ,  Cha-Jea Jo ,  Eun-Kyoung Choi ,  Ji-Seok Hong

IPC分类号： H01L23/49 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L29/06 ,  H01L21/768

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.

摘要翻译： 半导体封装包括第一半导体芯片，第二半导体芯片和密封构件。 第一半导体芯片包括具有与第一表面相对的第一表面和第二表面的基板，并且具有从第二表面以预定深度延伸的开口，以及从厚度方向从第一表面延伸的多个贯穿电极 通孔的端部通过开口的底表面露出。 第二半导体芯片被容纳在开口中并安装在开口的底表面上。 密封构件覆盖开口中的第二半导体芯片。

公开(公告)号：US20140299980A1

公开(公告)日：2014-10-09

申请号：US14160008

申请日：2014-01-21

申请人： Samsung Electronics Co., Ltd.

发明人： Eun-Kyoung Choi ,  Jong-Youn Kim ,  Sang-Wook Park ,  Hae-Jung Yu ,  In-Young Lee ,  Sang-Uk Han ,  Ji-Seok Hong

IPC分类号： H01L23/522 ,  H01L23/34

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

摘要翻译： 提供了包括散热器的半导体封装及其形成方法。 半导体封装可以包括顺序堆叠的第一半导体芯片，第二半导体芯片和散热器。 半导体封装还可以包括围绕第二半导体芯片并直接接触第二半导体芯片的侧壁的热界面材料（TIM）层。 TIM层的上表面可以直接接触散热器的下表面，并且TIM层的侧壁可以与散热器的侧壁基本上共面。 在一些实施例中，第一半导体芯片的侧壁可以与TIM层的侧壁基本共面。

公开(公告)号：US08816509B2

公开(公告)日：2014-08-26

申请号：US13733481

申请日：2013-01-03

申请人： Samsung Electronics Co., Ltd.

发明人： Ji-Seok Hong ,  Kwang-chul Choi ,  Sangwon Kim ,  Hyun-Jung Song ,  Eun-Kyoung Choi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L23/29 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/29017 ,  H01L2224/29036 ,  H01L2224/29099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83986 ,  H01L2224/84201 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

摘要翻译： 半导体封装包括通过连接结构电互连的第一和第二半导体元件。 第一和第二半导体元件通过保护结构连接，保护结构包括由保持层包围的粘合剂层。

公开(公告)号：US12040313B2

公开(公告)日：2024-07-16

申请号：US18133959

申请日：2023-04-12

申请人： Samsung Electronics Co., Ltd.

发明人： Hyuekjae Lee ,  Jihoon Kim ,  JiHwan Suh ,  So Youn Lee ,  Jihwan Hwang ,  Taehun Kim ,  Ji-Seok Hong

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L25/0652 ,  H01L21/565 ,  H01L24/08 ,  H01L24/80 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/08146 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2225/06589

摘要： A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material. A top surface of the first semiconductor chip and a top surface of the first molding layer are flat and are coplanar with each other, and a ratio of the difference between the coefficient of thermal expansion between the second molding layer and the first molding layer to the difference between the coefficient of thermal expansion between the second molding layer and the substrate is between 5:1 and 20:1.

公开(公告)号：US11824006B2

公开(公告)日：2023-11-21

申请号：US17492788

申请日：2021-10-04

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Byoung-Soo Kwak ,  Ji-Seok Hong

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L23/5384 ,  H01L23/31 ,  H01L23/5386 ,  H01L25/0655

摘要： A semiconductor package includes a first semiconductor chip having a first face and a second face opposite thereto. The first semiconductor chip includes a first wiring layer having a surface that forms the first face. A second semiconductor chip disposed on the first face of the first semiconductor chip includes a second wiring layer directly contacting the first wiring layer. A first mold layer is disposed on one lateral side of the first semiconductor chip and directly contacts the second wiring layer. A first via penetrates the first mold layer. A width of the first wiring layer and the first semiconductor chip in a horizontal direction are substantially the same. A width of the second wiring layer and the second semiconductor chip in the horizontal direction are substantially the same. A height of the first via and the first semiconductor chip in the vertical direction are substantially the same.

公开(公告)号：US08958011B2

公开(公告)日：2015-02-17

申请号：US13828618

申请日：2013-03-14

申请人： Samsung Electronics Co., Ltd.

发明人： Sang-Sick Park ,  Myung-Sung Kang ,  Ji-Seok Hong

IPC分类号： H04N5/225 ,  H04N5/232 ,  G03B13/00 ,  H04N9/04 ,  H01J7/24 ,  H01J40/14 ,  H01L31/0232 ,  H01L31/0203 ,  H01L21/00 ,  H01L31/00 ,  H01L27/146

CPC分类号： H04N5/2251 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T29/53178 ,  H01L2924/00

摘要： Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.

摘要翻译： 提供了包括其的双向相机模块和倒装芯片接合器。 模块包括分别安装有上传感器和下传感器的电路板，分别设置在上传感器和下传感器下的上透镜和下透镜，以及固定上透镜和下透镜间隔开的壳体 分别是上传感器和下传感器。 外壳围绕电路板。 壳体具有多个入口和空气流过的出口，并且壳体具有通过下透镜和下传感器之间的空间从入口连接到出口的空气通道。