Invention Grant
- Patent Title: Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture
- Patent Title (中): 紧凑的热控薄膜电阻器，利用基板触点和制造方法
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Application No.: US13588218Application Date: 2012-08-17
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Publication No.: US08541864B2Publication Date: 2013-09-24
- Inventor: Joseph M. Lukaitis , Jed H. Rankin , Robert R. Robison , Dustin K. Slisher , Timothy D. Sullivan
- Applicant: Joseph M. Lukaitis , Jed H. Rankin , Robert R. Robison , Dustin K. Slisher , Timothy D. Sullivan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David Cain
- Main IPC: H01L29/02
- IPC: H01L29/02
Abstract:
A method of forming a semiconductor structure includes forming a resistor on an insulator layer over a substrate, and forming at least one dielectric layer over the resistor. The method also includes forming a substrate contact through the at least one dielectric layer, through the resistor, through the insulator layer, and into the substrate. The substrate contact comprises a high thermal conductivity material.
Public/Granted literature
- US20120313215A1 COMPACT THERMALLY CONTROLLED THIN FILM RESISTORS UTILIZING SUBSTRATE CONTACTS AND METHODS OF MANUFACTURE Public/Granted day:2012-12-13
Information query
IPC分类:
