Invention Grant
- Patent Title: On-die logic analyzer for semiconductor die
- Patent Title (中): 用于半导体管芯的裸片逻辑分析仪
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Application No.: US13665198Application Date: 2012-10-31
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Publication No.: US08543776B2Publication Date: 2013-09-24
- Inventor: Tina C. Zhong , Jason G. Sandri , Kenneth P. Griesser , Lori R. Borger
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F13/28 ; G06F3/00 ; G01R31/28
Abstract:
In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
Public/Granted literature
- US20130054931A1 On-Die Logic Analyzer For Semiconductor Die Public/Granted day:2013-02-28
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