Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.