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公开(公告)号：US08986555B2
公开(公告)日：2015-03-24
申请号：US12892047
申请日：2010-09-28
Applicant: Ji-Eun Kim , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
Inventor： Ji-Eun Kim , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
CPC classification number: H05K3/4007 , H05K3/061 , H05K3/205 , H05K2201/0367 , H05K2203/0152 , H05K2203/0376
Abstract: A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.
Abstract translation: 公开了一种制造具有凸块的印刷电路板的方法。 该方法包括制备其上形成有第一电路的第一载体，将第一载体压缩到绝缘层的一个表面，使得第一电路被掩埋，根据凸点将在第一载体上堆叠抗蚀剂 通过蚀刻第一载体形成和形成凸块。 根据本发明的实施例，可以减小印刷电路板中的凸块与其相邻凸块之间的高度差，从而可以更好地实现电子部件和印刷电路板之间的电连接。
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2.发明授权Ball grid array substrate with insulating layer and semiconductor chip package 失效球栅阵列衬底采用绝缘层和半导体芯片封装公开(公告)号：US08546943B2
公开(公告)日：2013-10-01
申请号：US12923037
申请日：2010-08-30
Applicant: Jung Hyun Park , Nam Keun Oh , Sang Duck Kim , Jong Gyu Choi , Young Ji Kim , Ji Eun Kim , Myung Sam Kang
Inventor： Jung Hyun Park , Nam Keun Oh , Sang Duck Kim , Jong Gyu Choi , Young Ji Kim , Ji Eun Kim , Myung Sam Kang
IPC: H01L23/13 , H01L23/498
CPC classification number: H01L21/76885 , H01L21/02112 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.
Abstract translation: 提供了一种球栅阵列基板，半导体芯片封装及其制造方法。 球栅阵列基板包括绝缘层，其具有提供半导体芯片的安装区域的第一表面，与第一表面相对的第二表面和连接第二表面与半导体芯片的安装区域的开口，以及电路图案 埋在第二面。 由于球栅阵列基板通过堆叠两个绝缘层的方法制造，因此可以使用现有的装置，并且可以将球栅阵列基板制造为超薄板。 此外，由于电路图案被埋在绝缘层中，因此可以形成高密度电路图案。
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公开(公告)号：US20110110058A1
公开(公告)日：2011-05-12
申请号：US12748082
申请日：2010-03-26
Applicant: Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim , Young-Hwan Shin , Kyung-Ro Yoon
Inventor： Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim , Young-Hwan Shin , Kyung-Ro Yoon
CPC classification number: H05K3/00 , H01L2224/16225 , H05K3/30 , Y10T29/49124
Abstract: A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.
Abstract translation: 公开了一种单层片上封装衬底及其制造方法。 根据本发明的实施例，片上封装衬底上的单层板包括形成在绝缘体上表面上的绝缘体，电路图案和倒装焊接焊盘，导体凸块， 与电路图案的下表面接触并穿透绝缘体，阻焊层，其形成在绝缘体的上表面上，使得至少一部分倒装芯片接合焊盘露出，并且 倒装芯片焊接凸块，其形成在倒装焊盘的上表面上，以便与电子部件进行倒装芯片连接。
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公开(公告)号：US20110100952A1
公开(公告)日：2011-05-05
申请号：US12892047
申请日：2010-09-28
Applicant: Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
Inventor： Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
IPC: H05K3/06
CPC classification number: H05K3/4007 , H05K3/061 , H05K3/205 , H05K2201/0367 , H05K2203/0152 , H05K2203/0376
Abstract: A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.
Abstract translation: 公开了一种制造具有凸块的印刷电路板的方法。 该方法包括制备其上形成有第一电路的第一载体，将第一载体压缩到绝缘层的一个表面，使得第一电路被掩埋，根据凸点将在第一载体上堆叠抗蚀剂 通过蚀刻第一载体形成和形成凸块。 根据本发明的实施例，可以减小印刷电路板中的凸块与其相邻凸块之间的高度差，从而可以更好地实现电子部件和印刷电路板之间的电连接。
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公开(公告)号：US08465992B2
公开(公告)日：2013-06-18
申请号：US13200398
申请日：2011-09-23
Applicant: Seung-Hun Kim , Hoon-Kee Min , Dong-Un Jin , Sang-Joon Seo , Sung-Guk An , Young-Gu Kim , Hyung-Sik Kim , Young-Ji Kim
Inventor： Seung-Hun Kim , Hoon-Kee Min , Dong-Un Jin , Sang-Joon Seo , Sung-Guk An , Young-Gu Kim , Hyung-Sik Kim , Young-Ji Kim
IPC: H01L21/84
CPC classification number: H01L51/003 , H01L27/3244 , H01L51/5253 , H01L2227/326 , H01L2251/5338
Abstract: A method of manufacturing a flexible display device is provided. The method includes: preparing a first flexible substrate on which a display unit is formed; forming an encapsulation unit including a base substrate, a second flexible substrate formed on the base substrate, and a barrier layer formed on the second flexible substrate; combining the encapsulation unit with the display unit; and separating the base substrate from the second flexible substrate by using a difference between a coefficient of thermal expansion of the base substrate and a coefficient of thermal expansion of the second flexible substrate, by applying a heated solution between the base substrate and the second flexible substrate. The flexible display device is easily manufactured since the base substrate and the second flexible substrate, which have different coefficients of thermal expansion and are coupled to each other, are separable from each other by applying the heated solution.
Abstract translation: 提供一种制造柔性显示装置的方法。 该方法包括：制备其上形成有显示单元的第一柔性基板; 形成包括基底基板，形成在基底基板上的第二柔性基板和形成在第二柔性基板上的阻挡层的封装单元; 将封装单元与显示单元组合; 并且通过使用基底基板的热膨胀系数与第二柔性基板的热膨胀系数之间的差异，通过在基底基板和第二柔性基板之间施加加热溶液来分离基底基板与第二柔性基板 。 柔性显示装置容易制造，因为具有不同的热膨胀系数并且彼此耦合的基底基板和第二柔性基板通过施加加热的溶液而彼此分离。
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Patent Agency Ranking
6.发明申请Ball grid array substrate, semiconductor chip package and method of manufacturing the same 失效球栅阵列基板，半导体芯片封装及其制造方法公开(公告)号：US20110095425A1
公开(公告)日：2011-04-28
申请号：US12923037
申请日：2010-08-30
Applicant: Jung Hyun Park , Nam Keun Oh , Sang Duck Kim , Jong Gyu Choi , Young Ji Kim , Ji Eun Kim , Myung Sam Kang
Inventor： Jung Hyun Park , Nam Keun Oh , Sang Duck Kim , Jong Gyu Choi , Young Ji Kim , Ji Eun Kim , Myung Sam Kang
IPC: H01L23/498 , H01L21/768 , H01L21/50
CPC classification number: H01L21/76885 , H01L21/02112 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.
Abstract translation: 提供了一种球栅阵列基板，半导体芯片封装及其制造方法。 球栅阵列基板包括绝缘层，其具有提供半导体芯片的安装区域的第一表面，与第一表面相对的第二表面和连接第二表面与半导体芯片的安装区域的开口，以及电路图案 埋在第二面。 由于球栅阵列基板通过堆叠两个绝缘层的方法制造，因此可以使用现有的装置，并且可以将球栅阵列基板制造为超薄板。 此外，由于电路图案被埋在绝缘层中，因此可以形成高密度电路图案。
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公开(公告)号：US09673014B2
公开(公告)日：2017-06-06
申请号：US13930836
申请日：2013-06-28
Applicant: Young-Ji Kim , Young-Gu Kim , Hyun-Jun Cho , Hyo-Young Mun
Inventor： Young-Ji Kim , Young-Gu Kim , Hyun-Jun Cho , Hyo-Young Mun
IPC: H01J9/00 , G02F1/1333
CPC classification number: H01J9/00 , G02F1/133351 , G02F2001/133311 , G02F2001/133331 , H01L2227/326
Abstract: A method of manufacturing a display panel includes forming a mother panel on a base substrate, attaching an upper passivation film to the mother panel, detaching the base substrate from the mother panel, attaching a lower film to the mother panel, and cutting the mother panel to which the upper passivation film and the lower film are attached to form the display panel, the display panel being in a form of a cell unit. The display panel includes a display substrate, a display device layer, and a thin film encapsulation layer.
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公开(公告)号：US20140061610A1
公开(公告)日：2014-03-06
申请号：US13941448
申请日：2013-07-12
Applicant: Hyo-Young Mun , Young-Gu Kim , Young-Ji Kim , Hyun-Jun Cho
Inventor： Hyo-Young Mun , Young-Gu Kim , Young-Ji Kim , Hyun-Jun Cho
CPC classification number: H01L51/56 , C08J7/047 , C08J2333/00 , C08J2423/06 , H01L27/3244 , H01L51/003 , H01L51/0097 , H01L51/524 , H01L51/5253 , H01L51/5256 , H01L51/529 , H01L2251/5338 , H01L2251/566 , Y02E10/549 , Y02P70/521
Abstract: A method for manufacturing an organic light emitting device includes: forming an organic light emitting display panel including a substrate provided on a support substrate, an organic light emitting element on the substrate, and a thin film encapsulating film covering the organic light emitting element; detaching the support substrate from the organic light emitting display panel; attaching a bottom protecting film to a bottom of the organic light emitting display panel, the bottom protecting film comprising a first electricity removing layer configured to remove static electricity; and cutting the organic light emitting display panel into a plurality of organic light emitting devices.
Abstract translation: 一种制造有机发光器件的方法包括：形成包括设置在支撑基板上的基板和基板上的有机发光元件的有机发光显示面板和覆盖有机发光元件的薄膜封装膜; 从所述有机发光显示面板分离所述支撑基板; 将底部保护膜附着到有机发光显示面板的底部，所述底部保护膜包括构造成去除静电的第一除电层; 并将有机发光显示面板切割成多个有机发光器件。
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公开(公告)号：US20140017967A1
公开(公告)日：2014-01-16
申请号：US13930836
申请日：2013-06-28
Applicant: Young-Ji KIM , Young-Gu KIM , Hyun-Jun CHO , Hyo-Young MUN
Inventor： Young-Ji KIM , Young-Gu KIM , Hyun-Jun CHO , Hyo-Young MUN
IPC: H01J9/00
CPC classification number: H01J9/00 , G02F1/133351 , G02F2001/133311 , G02F2001/133331 , H01L2227/326
Abstract: A method of manufacturing a display panel includes forming a mother panel on a base substrate, attaching an upper passivation film to the mother panel, detaching the base substrate from the mother panel, attaching a lower film to the mother panel, and cutting the mother panel to which the upper passivation film and the lower film are attached to form the display panel, the display panel being in a form of a cell unit. The display panel includes a display substrate, a display device layer, and a thin film encapsulation layer.
Abstract translation: 一种制造显示面板的方法，包括在基底基板上形成母板，将上钝化膜附着到母板上，将母基板与母板分离，将下膜连接到母板上，切割母板 上部钝化膜和下部膜附着在其上以形成显示面板，显示面板为单元单元的形式。 显示面板包括显示基板，显示装置层和薄膜封装层。
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公开(公告)号：US20120244662A1
公开(公告)日：2012-09-27
申请号：US13491279
申请日：2012-06-07
Applicant: Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim , Young-Hwan Shin , Kyung-Ro Yoon
Inventor： Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim , Young-Hwan Shin , Kyung-Ro Yoon
IPC: H01L21/50
CPC classification number: H05K3/00 , H01L2224/16225 , H05K3/30 , Y10T29/49124
Abstract: A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.
Abstract translation: 公开了一种单层片上封装衬底及其制造方法。 根据本发明的实施例，片上封装衬底上的单层板包括形成在绝缘体上表面上的绝缘体，电路图案和倒装焊接焊盘，导体凸块， 与电路图案的下表面接触并穿透绝缘体，阻焊层，其形成在绝缘体的上表面上，使得至少一部分倒装芯片接合焊盘露出，并且 倒装芯片焊接凸块，其形成在倒装焊盘的上表面上，以便与电子部件进行倒装芯片连接。
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