发明授权
- 专利标题： Clad solder thermal interface material
- 专利标题（中）： 包层焊料热界面材料
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申请号： US13020152申请日： 2011-02-03
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公开(公告)号： US08550327B2公开(公告)日： 2013-10-08
- 发明人: Carl L. Deppisch , Rajasekaran Swaminathan
- 申请人： Carl L. Deppisch , Rajasekaran Swaminathan
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace.
公开/授权文献
- US20110147914A1 Clad Solder Thermal Interface Material 公开/授权日：2011-06-23
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