Invention Grant
- Patent Title: Silicon-on-insulator high power amplifiers
- Patent Title (中): 绝缘体上的绝缘体大功率放大器
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Application No.: US13733889Application Date: 2013-01-04
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Publication No.: US08558619B2Publication Date: 2013-10-15
- Inventor: Saeed Mohammadi , Sultan R. Helmi , Jing-Hwa Chen , Andrew J. Robison
- Applicant: Purdue Research Foundation
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agency: Barnes & Thornburg LLP
- Main IPC: H03F3/16
- IPC: H03F3/16

Abstract:
Illustrative embodiments of power amplifiers are disclosed. In one embodiment, a power amplifier includes a plurality of transistors formed on a silicon-on-insulator (SOI) substrate such that the plurality of transistors are each electrically isolated from one another within the SOI substrate. The power amplifier also includes a plurality of biasing networks, each biasing network being configured to dynamically bias at least one of the plurality of transistors. The plurality of transistors are electrically coupled in a series stack, with an output of the power amplifier being provided across the series stack.
Public/Granted literature
- US20130120065A1 Silicon-on-Insulator High Power Amplifiers Public/Granted day:2013-05-16
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