Invention Grant
US08580386B2 Laminate comprising curable epoxy film layer comprising a di-isoimide and process for preparing same
有权
包含含有二异氰酸酯的可固化环氧薄膜层的层合物及其制备方法
- Patent Title: Laminate comprising curable epoxy film layer comprising a di-isoimide and process for preparing same
- Patent Title (中): 包含含有二异氰酸酯的可固化环氧薄膜层的层合物及其制备方法
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Application No.: US13168062Application Date: 2011-06-24
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Publication No.: US08580386B2Publication Date: 2013-11-12
- Inventor: George Elias Zahr
- Applicant: George Elias Zahr
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B32B27/38
- IPC: B32B27/38 ; C08G61/02 ; C07D251/00 ; C08L63/00 ; C07D293/10 ; C08K9/00
Abstract:
The present invention deals with a laminate useful for forming fully encapsulated flexible printed wiring boards. The laminate comprises a dielectric substrate coated with a curable composition comprising an epoxy and a novel aromatic di-isoimide chemical compound. The curable composition provides the benefit of thermal latency, improving shelf-life, and reducing premature curing during processing. Fully encapsulated printed wiring boards are also disclosed.
Public/Granted literature
- US20120328874A1 LAMINATE COMPRISING CURABLE EPOXY FILM LAYER COMPRISING A DI-ISOIMIDE AND PROCESS FOR PREPARING SAME Public/Granted day:2012-12-27
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