Methods for conjugating nucleic acids with small molecules
    2.
    发明授权
    Methods for conjugating nucleic acids with small molecules 有权
    将核酸与小分子结合的方法

    公开(公告)号:US08765934B2

    公开(公告)日:2014-07-01

    申请号:US13188989

    申请日:2011-07-22

    Abstract: A method for conjugating a nucleic acid with a molecule is provided. The method includes steps of (a) reacting the nucleic acid having a 5′-monophosphate with an activating agent in a first buffer to form a solution; (b) mixing an alcohol with the solution formed in the step (a) to obtain an intermediate; and (c) dissolving the intermediate in a second buffer containing an ethylenediaminetetraacetic acid (EDTA) and adding a nucleophile thereinto to react the intermediate with the nucleophile.

    Abstract translation: 提供了用于将核酸与分子缀合的方法。 该方法包括以下步骤:(a)使具有5'-单磷酸的核酸与活化剂在第一缓冲液中反应形成溶液; (b)将醇与步骤(a)中形成的溶液混合以获得中间体; 和(c)将中间体溶解在含有乙二胺四乙酸(EDTA)的第二缓冲液中并加入亲核试剂以使中间体与亲核试剂反应。

    Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
    3.
    发明授权
    Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same 有权
    由包含二异氰酸酯的粘合层压板包封的印刷线路板及其制备方法

    公开(公告)号:US08663804B2

    公开(公告)日:2014-03-04

    申请号:US13168069

    申请日:2011-06-24

    CPC classification number: H05K3/386 H05K3/281 H05K2203/1189 Y10T428/31511

    Abstract: The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing.

    Abstract translation: 本发明涉及印刷电路板形式的柔性印刷线路板,其中导电元件被包含新型芳族二异亚酰亚胺化合物的环氧粘合剂完全包封。 从而保护导电元件。 柔性印刷电路板容易在100-250℃的温度下固化。然而,在固化之前,通过环氧树脂粘合剂的潜固化特征,印刷电路板的粘合剂组分具有延伸架 生活,避免加工过早固化。

    Laminate comprising curable epoxy film layer comprising a di-isoimide and process for preparing same
    4.
    发明授权
    Laminate comprising curable epoxy film layer comprising a di-isoimide and process for preparing same 有权
    包含含有二异氰酸酯的可固化环氧薄膜层的层合物及其制备方法

    公开(公告)号:US08580386B2

    公开(公告)日:2013-11-12

    申请号:US13168062

    申请日:2011-06-24

    CPC classification number: C08J7/047 C08J2463/00 Y10T428/269 Y10T428/31511

    Abstract: The present invention deals with a laminate useful for forming fully encapsulated flexible printed wiring boards. The laminate comprises a dielectric substrate coated with a curable composition comprising an epoxy and a novel aromatic di-isoimide chemical compound. The curable composition provides the benefit of thermal latency, improving shelf-life, and reducing premature curing during processing. Fully encapsulated printed wiring boards are also disclosed.

    Abstract translation: 本发明涉及用于形成完全封装的柔性印刷线路板的层压板。 层压体包括涂覆有包含环氧树脂和新型芳族二异亚酰亚胺化合物的可固化组合物的电介质基材。 可固化组合物提供热潜伏期的益处,改善保存期限,并减少加工过程中的过早固化。 还公开了完全封装的印刷线路板。

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