Invention Grant
- Patent Title: Laminated type ceramic electronic parts
- Patent Title (中): 层压型陶瓷电子零件
-
Application No.: US13300952Application Date: 2011-11-21
-
Publication No.: US08582277B2Publication Date: 2013-11-12
- Inventor: Hirobumi Tanaka , Makoto Endo , Satoko Ueda , Daisuke Ueda , Shogo Murosawa , Daisuke Yoshida , Kenta Ono , Minoru Ogasawara , Tatsuya Kikuchi
- Applicant: Hirobumi Tanaka , Makoto Endo , Satoko Ueda , Daisuke Ueda , Shogo Murosawa , Daisuke Yoshida , Kenta Ono , Minoru Ogasawara , Tatsuya Kikuchi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2010-260342 20101122; JP2010-262774 20101125; JP2011-251975 20111117
- Main IPC: H01G4/12
- IPC: H01G4/12 ; C04B35/468

Abstract:
A multilayer ceramic electronic component comprising an element body in which a dielectric layer and an internal electrode layer are stacked. The dielectric layer is constituted from a dielectric ceramic composition including; a compound having a perovskite structure expressed by a formula of ABO3 (A is at least one selected from Ba, Ca, and Sr; B is at least one selected from Ti, Zr, and Hf); an oxide of Mg; an oxide of rare earth elements including Sc and Y; and an oxide including Si. The dielectric ceramic composition comprises a plurality of dielectric particles and a grain boundary present in between the dielectric particles. In the grain boundary, when content ratios of Mg and Si are set to D(Mg) and D(Si) respectively, D(Mg) is 0.2 to 1.8 wt % in terms of MgO, and D(Si) is 0.4 to 8.0 wt % in terms of SiO2.
Public/Granted literature
- US20120162858A1 LAMINATED TYPE CERAMIC ELECTRONIC PARTS Public/Granted day:2012-06-28
Information query