发明授权
- 专利标题： Transparent conductive laminate and process of producing the same
- 专利标题（中）： 透明导电层压板及其制造方法
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申请号： US11101548申请日： 2005-04-08
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公开(公告)号： US08597475B2公开(公告)日： 2013-12-03
- 发明人: Kazuaki Sasa , Kazunori Kawamura , Keiko Toyozawa , Tomohiko Maeda
- 申请人： Kazuaki Sasa , Kazunori Kawamura , Keiko Toyozawa , Tomohiko Maeda
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JPP.2002-104676 20020408
- 主分类号： C23C14/00
- IPC分类号： C23C14/00 ; C23C14/32
摘要：
A transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding, and a process for producing the same. The transparent conductive layer is excellent in transparency and wet heat confidence and is not excessively low in specific resistivity. The transparent conductive laminate includes a substrate comprising an organic polymer molding having formed thereon a completely crystallized, transparent conductive layer comprising an In.Sn composite oxide having an amount of Sn atom of 1 to 6% by weight based on the total weight of In atom and Sn atom and having a film thickness of 15 to 50 nm, a Hall mobility of 30 to 45 cm2/V·S, and a carrier density of from 2×1020/cm3 to 6×1020/cm3.
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