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公开(公告)号：US08597475B2
公开(公告)日：2013-12-03
申请号：US11101548
申请日：2005-04-08
CPC分类号： C23C14/086 , Y10S428/923 , Y10S428/926 , Y10T428/26 , Y10T428/265
摘要： A transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding, and a process for producing the same. The transparent conductive layer is excellent in transparency and wet heat confidence and is not excessively low in specific resistivity. The transparent conductive laminate includes a substrate comprising an organic polymer molding having formed thereon a completely crystallized, transparent conductive layer comprising an In.Sn composite oxide having an amount of Sn atom of 1 to 6% by weight based on the total weight of In atom and Sn atom and having a film thickness of 15 to 50 nm, a Hall mobility of 30 to 45 cm2/V·S, and a carrier density of from 2×1020/cm3 to 6×1020/cm3.
摘要翻译： 在包含有机聚合物成型体的基材上具有完全结晶的透明导电层的透明导电层压体及其制造方法。 透明导电层的透明性和湿热可靠性优异，并且电阻率不会过低。 透明导电性层叠体包括具有形成有完全结晶化的透明导电层的有机聚合物成型体的基材，该透明导电层包含相对于In原子总重量，Sn原子量为1〜6重量％的In.Sn复合氧化物 和Sn原子，膜厚度为15〜50nm，霍尔迁移率为30〜45cm2 / V·S，载流子密度为2×1020 / cm3〜6×1020 / cm3。
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公开(公告)号：US06908666B2
公开(公告)日：2005-06-21
申请号：US10407421
申请日：2003-04-07
CPC分类号： C23C14/086 , Y10S428/923 , Y10S428/926 , Y10T428/26 , Y10T428/265
摘要： A transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding, and a process for producing the same. The transparent conductive layer is excellent in transparency and wet heat confidence and is not excessively low in specific resistivity. The transparent conductive laminate includes a substrate comprising an organic polymer molding having formed thereon a completely crystallized, transparent conductive layer comprising an In—Sn composite oxide having an amount of Sn atom of 1 to 6% by weight based on the total weight of In atom and Sn atom and having a film thickness of 15 to 50 nm, a Hall mobility of 30 to 45 cm2/V-S, and a carrier density of from 2×1020/cm3 to 6×1020/cm3.
摘要翻译： 在包含有机聚合物成型体的基材上具有完全结晶的透明导电层的透明导电层压体及其制造方法。 透明导电层的透明性和湿热可靠性优异，并且电阻率不会过低。 透明导电性层叠体包括具有形成有完全结晶的透明导电层的有机聚合物成型体的基板，该透明导电层包含Sn原子占In原子总重量的1〜6重量％的In-Sn复合氧化物 和Sn原子，并且具有15至50nm的膜厚度，30至45cm 2 / Vs的霍尔迁移率和2×10 20 / cm的载流子密度 3×3×6×10 20 / cm 3以上。
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公开(公告)号：US20050173706A1
公开(公告)日：2005-08-11
申请号：US11101548
申请日：2005-04-08
CPC分类号： C23C14/086 , Y10S428/923 , Y10S428/926 , Y10T428/26 , Y10T428/265
摘要： A transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding, and a process for producing the same. The transparent conductive layer is excellent in transparency and wet heat confidence and is not excessively low in specific resistivity. The transparent conductive laminate includes a substrate comprising an organic polymer molding having formed thereon a completely crystallized, transparent conductive layer comprising an In.Sn composite oxide having an amount of Sn atom of 1 to 6% by weight based on the total weight of In atom and Sn atom and having a film thickness of 15 to 50 nm, a Hall mobility of 30 to 45 cm2/V·S, and a carrier density of from 2×1020/cm3 to 6×1020/cm3.
摘要翻译： 在包含有机聚合物成型体的基材上具有完全结晶的透明导电层的透明导电层压体及其制造方法。 透明导电层的透明性和湿热可靠性优异，并且电阻率不会过低。 透明导电性层叠体包括具有形成有完全结晶化的透明导电层的有机聚合物成型体的基材，该透明导电层包含相对于In原子总重量，Sn原子量为1〜6重量％的In.Sn复合氧化物 和Sn原子，并且具有15至50nm的膜厚度，30至45cm 2 / Vs的霍尔迁移率和2×10 20 / cm的载流子密度 3×3×6×10 20 / cm 3以上。
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公开(公告)号：US20050244620A1
公开(公告)日：2005-11-03
申请号：US11108720
申请日：2005-04-19
CPC分类号： H05K3/388 , H05K3/108 , H05K3/244 , H05K3/28 , H05K2203/072 , Y10T428/12715 , Y10T428/1291 , Y10T428/24917
摘要： A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin plating, a wiring of the wired circuit pattern can be prevented from being stripped, and a production method of the same wired circuit board. After a thin metal film 2 formed of nickel-chromium alloy having a chromium content of 8-20 weight % is formed on an insulating layer 1, a wired circuit pattern 4 of copper is formed on the thin metal film 2. Then, a tin plating layer 5 is formed on exposed surfaces of the wired circuit pattern 4 by electroless tin plating.
摘要翻译： 一种布线电路板，其形成为即使当以细间距形成布线电路图案，然后通过无电镀锡在布线电路图案上形成锡镀层时，可以防止布线电路图案的布线 被剥离，以及相同布线电路板的制造方法。 在绝缘层1上形成由铬含量为8〜20重量％的镍 - 铬合金形成的金属薄膜2之后，在金属薄膜2上形成铜布线电路图案4。 然后，通过无电镀锡在布线电路图案4的露出表面上形成镀锡层5。
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