- Patent Title: Package substrate and die spacer layers having a ceramic backbone
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Application No.: US13374858Application Date: 2012-01-19
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Publication No.: US08604353B2Publication Date: 2013-12-10
- Inventor: Aleksandar Aleksov , Vladimir Noveski , Sujit Sharan , Shankar Ganapathysubramanian
- Applicant: Aleksandar Aleksov , Vladimir Noveski , Sujit Sharan , Shankar Ganapathysubramanian
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zea, Barlocci & Markvardsen
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B23K1/20 ; B23K31/02 ; B05D5/12 ; B05D3/00
Abstract:
A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.
Public/Granted literature
- US20120152601A1 Package substrate and die spacer layers having a ceramic backbone Public/Granted day:2012-06-21
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