发明授权
- 专利标题: Semiconductor device including trenches having particular structures
- 专利标题(中): 半导体器件包括具有特定结构的沟槽
-
申请号: US13842002申请日: 2013-03-15
-
公开(公告)号: US08604551B2公开(公告)日: 2013-12-10
- 发明人: Sung-Woo Hyun , Yu-Gyun Shin , Sun-Ghil Lee , Hong-Sik Yoon
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 代理机构: Muir Patent Consulting, PLLC
- 优先权: KR10-2010-0082478 20100825
- 主分类号: H01L27/088
- IPC分类号: H01L27/088
摘要:
A semiconductor device includes a substrate, a first region and a second region. Each of the first region and second region includes a trench, an epitaxial layer including a source/drain having a first part and a second part, the first part extending from a top surface of the substrate to a top surface of the source/drain and the second part extending from the top surface of the substrate to a bottom surface of the source/drain in the trench. The cross-sectional shape of the first part of the source/drain of the first region is the same as the cross-sectional shape of the first part of the source/drain of the second region. The cross-sectional shape of the second past of the source/drain of the find region is different from the cross-sectional shape of the second part of the source/drain of the second region.
公开/授权文献
信息查询
IPC分类: