Semiconductor device including trenches having particular structures
    2.
    发明授权
    Semiconductor device including trenches having particular structures 有权
    半导体器件包括具有特定结构的沟槽

    公开(公告)号:US08604551B2

    公开(公告)日:2013-12-10

    申请号:US13842002

    申请日:2013-03-15

    IPC分类号: H01L27/088

    摘要: A semiconductor device includes a substrate, a first region and a second region. Each of the first region and second region includes a trench, an epitaxial layer including a source/drain having a first part and a second part, the first part extending from a top surface of the substrate to a top surface of the source/drain and the second part extending from the top surface of the substrate to a bottom surface of the source/drain in the trench. The cross-sectional shape of the first part of the source/drain of the first region is the same as the cross-sectional shape of the first part of the source/drain of the second region. The cross-sectional shape of the second past of the source/drain of the find region is different from the cross-sectional shape of the second part of the source/drain of the second region.

    摘要翻译: 半导体器件包括衬底,第一区域和第二区域。 第一区域和第二区域中的每一个包括沟槽,包括具有第一部分和第二部分的源极/漏极的外延层,第一部分从衬底的顶表面延伸到源极/漏极的顶表面, 第二部分从衬底的顶表面延伸到沟槽中的源极/漏极的底表面。 第一区域的源极/漏极的第一部分的截面形状与第二区域的源极/漏极的第一部分的横截面形状相同。 查找区域的源极/漏极的第二过去的截面形状与第二区域的源极/漏极的第二部分的截面形状不同。