Invention Grant
- Patent Title: Polycrystalline diamond compacts, method of fabricating same, and various applications
- Patent Title (中): 多晶金刚石压块,其制造方法以及各种应用
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Application No.: US13623764Application Date: 2012-09-20
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Publication No.: US08616306B2Publication Date: 2013-12-31
- Inventor: Kenneth E. Bertagnolli , Michael A. Vail , Jason K. Wiggins , Jiang Qian , David P. Miess , Debkumar Mukhopadhyay
- Applicant: US Synthetic Corporation
- Applicant Address: US UT Orem
- Assignee: US Synthetic Corporation
- Current Assignee: US Synthetic Corporation
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: E21B10/36
- IPC: E21B10/36 ; E21B10/46

Abstract:
Embodiments of the invention relate to a polycrystalline diamond compact. In an embodiment, the polycrystalline diamond compact includes a substrate and a polycrystalline diamond table including a first polycrystalline diamond layer bonded to the substrate and at least a second polycrystalline diamond layer. At least an un-leached portion of the polycrystalline diamond table includes a plurality of diamond grains defining a plurality of interstitial regions and a metal-solvent catalyst occupying at least a portion of the plurality of interstitial regions. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oe or more and a specific magnetic saturation of about 15 G·cm3/g or less. The second polycrystalline diamond layer exhibits a second average diamond grain size that is less than a first average diamond grain size of the first polycrystalline diamond layer and/or the first polycrystalline diamond layer includes a tungsten-containing material therein.
Public/Granted literature
- US20130015001A1 POLYCRYSTALLINE DIAMOND COMPACTS, METHOD OF FABRICATING SAME, AND VARIOUS APPLICATIONS Public/Granted day:2013-01-17
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