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    SUPERABRASIVE ELEMENTS AND RELATED METHODS FOR PROCESSING AND MANUFACTURING USING PROTECTIVE LAYERS
    1.
    发明申请
    SUPERABRASIVE ELEMENTS AND RELATED METHODS FOR PROCESSING AND MANUFACTURING USING PROTECTIVE LAYERS 有权

    公开(公告)号：US20220388121A1

    公开(公告)日：2022-12-08

    申请号：US17890218

    申请日：2022-08-17

    申请人： US Synthetic Corporation

    发明人： David P. Miess ,  Andrew E. Dadson

    IPC分类号： B24D3/00 ,  B24D18/00 ,  B24D99/00 ,  F16C33/04 ,  F16C33/26

    摘要： A method of processing a polycrystalline diamond element includes forming a protective layer over a selected portion of a polycrystalline diamond element, the polycrystalline diamond element having a polycrystalline diamond table that includes a superabrasive face, a superabrasive side surface, and a chamfer extending between the superabrasive face and the superabrasive side surface. A portion of the superabrasive side surface is covered by the protective layer and the protective layer is not formed over the chamfer. The method includes exposing at least a portion of the polycrystalline diamond element to a leaching solution. A polycrystalline diamond element has a polycrystalline diamond table that includes a leached volume extending from the superabrasive face to a portion of the chamfer proximate to the superabrasive side surface, and the leached volume does not substantially extend along the superabrasive side surface.

    POLYCRYSTALLINE DIAMOND COMPACT, DRILL BIT INCORPORATING SAME, AND METHODS OF MANUFACTURE
    4.
    发明申请
    POLYCRYSTALLINE DIAMOND COMPACT, DRILL BIT INCORPORATING SAME, AND METHODS OF MANUFACTURE 审中-公开

    公开(公告)号：US20190118345A1

    公开(公告)日：2019-04-25

    申请号：US16221115

    申请日：2018-12-14

    申请人： US Synthetic Corporation

    发明人： David P. Miess

    IPC分类号： B24D18/00 ,  E21B10/573 ,  B24D3/06 ,  E21B10/55

    摘要： Methods of making superabrasive elements may include forming a first superabrasive body, forming discrete components from the first superabrasive body, and then forming a second abrasive element from the discrete components. For example, microstructures (e.g., micro-cylinders or other geometries) may be formed from the first superabrasive element, catalyst materials may be removed from the microstructures, with the microstructures being recombined and bonded during a subsequent high-pressure, high-temperature (HPHT) process. In other embodiments, superabrasive elements may be formed to include microfeatures formed in a surface of a superabrasive body or table. For example, blind holes or slots may be formed in a surface of the element for use in attaching the superabrasive table to a substrate. The holes may be coated to provide an impermeable surface, or they may be filled with a metallic material to enhance the attachment to a substrate.

    Polycrystalline diamond compact including crack-resistant polycrystalline diamond table
    7.
    发明授权
    Polycrystalline diamond compact including crack-resistant polycrystalline diamond table 有权

    公开(公告)号：US10022840B1

    公开(公告)日：2018-07-17

    申请号：US14515768

    申请日：2014-10-16

    申请人： US SYNTHETIC CORPORATION

    发明人： David P. Miess

    IPC分类号： B24D3/00 ,  B24D3/02 ,  B24D11/00 ,  B24D18/00 ,  C09K3/14 ,  B24D99/00 ,  E21B10/567

    摘要： Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a substrate and a polycrystalline diamond (“PCD”) table mounted to the substrate. The PCD table includes an upper surface and one or more recesses extending inwardly from the upper surface of the PCD table. The one or more recesses may help prevent, stop, or limit crack propagation and may redistribute, breakup, or relieve stresses in the PCD table. In some embodiments, the one or more recesses exhibit, in plain view, a generally rectangular geometry, a generally circular geometry, or a generally triangular geometry. In some embodiments, the PCD table includes one or more channels that extend from a vertex of the one or more recesses. In some embodiments, the one or more channels and the one or more recesses may be at least partially filled with a sacrificial material. Methods for forming such PDCs are also discussed.

    METHODS OF MAKING A POLYCRYSTALLINE DIAMOND COMPACT INCLUDING A POLYCRYSTALLINE DIAMOND TABLE WITH A THERMALLY-STABLE REGION HAVING AT LEAST ONE LOW-CARBON-SOLUBILITY MATERIAL
    10.
    发明申请
    METHODS OF MAKING A POLYCRYSTALLINE DIAMOND COMPACT INCLUDING A POLYCRYSTALLINE DIAMOND TABLE WITH A THERMALLY-STABLE REGION HAVING AT LEAST ONE LOW-CARBON-SOLUBILITY MATERIAL 审中-公开
    制造多晶金刚石复合材料的方法，包括具有至少一种低碳可溶性材料的热稳定区域的多晶金刚石表

    公开(公告)号：US20160263725A1

    公开(公告)日：2016-09-15

    申请号：US14633041

    申请日：2015-02-26

    申请人： US SYNTHETIC CORPORATION

    发明人： David P. Miess ,  Michael A. Vail ,  Kenneth E. Bertagnolli ,  C. Eugene McMurray ,  Paul Douglas Jones

    IPC分类号： B24D3/06 ,  B24D18/00 ,  E21B10/567

    CPC分类号： B24D18/0009 ,  B24D3/02 ,  B24D3/06 ,  B24D3/10 ,  B24D99/005 ,  E21B10/567 ,  E21B10/5676 ,  E21B2010/561

    摘要： Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a polycrystalline diamond (“PCD”) table including a thermally-stable region having at least one low-carbon-solubility material disposed interstitially between bonded diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween and defining a plurality of interstitial regions. The PCD table further includes at least one low-carbon-solubility material disposed in at least a portion of the plurality of interstitial regions. The at least one low-carbon-solubility material exhibits a melting temperature of about 1300° C. or less and a bulk modulus at 20° C. of less than about 150 GPa.

    摘要翻译： 本发明的实施方案涉及包含多晶金刚石（“PCD”）表的多晶金刚石压块（“PDC”），其包括热稳定区域，该热稳定区域具有间隙地设置在其结合的金刚石晶粒之间的至少一种低碳溶解度材料， 制造这样的PDC。 在一个实施例中，PDC包括基板和与基板结合的PCD台。 PCD台包括在其间显示金刚石到金刚石结合的多个金刚石晶粒并且限定多个间隙区域。 PCD表还包括设置在多个间隙区域的至少一部分中的至少一个低碳溶解度材料。 所述至少一种低碳溶解性材料的熔融温度为约1300℃以下，在20℃下的体积弹性模量小于约150GPa。