发明授权
- 专利标题： Electronics component embedded PCB
- 专利标题（中）： 电子元器件嵌入式PCB
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申请号： US12915707申请日： 2010-10-29
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公开(公告)号： US08618421B2公开(公告)日： 2013-12-31
- 发明人: Jung-Soo Byun , Yul-Kyo Chung , Hwa-Sun Park , Kyung-Min Lee , Mike Kim , Doo-hwan Lee
- 申请人： Jung-Soo Byun , Yul-Kyo Chung , Hwa-Sun Park , Kyung-Min Lee , Mike Kim , Doo-hwan Lee
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2009-0103766 20091029
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.
公开/授权文献
- US20110100689A1 ELECTRONICS COMPONENT EMBEDDED PCB 公开/授权日：2011-05-05