公开(公告)号：US20130119553A1

公开(公告)日：2013-05-16

申请号：US13438483

申请日：2012-04-03

申请人： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

发明人： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L29/0657 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/15156 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H01L2924/00

摘要： Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.

摘要翻译： 本文公开了一种半导体封装，其包括具有第一侧表面的电气装置; 以及包括其中定位所述电气装置的空腔的芯基板，其中所述芯基板在所述芯基板的厚度方向上倾斜并且具有限定所述空腔的第二侧表面。

公开(公告)号：US20120087097A1

公开(公告)日：2012-04-12

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang HONG ,  Bong Kyu CHOI ,  Je Gwang Yoo ,  Sang Wuk JUN ,  Sang Kab PARK ,  Jung Soo Byun

发明人： Suk Chang HONG ,  Bong Kyu CHOI ,  Je Gwang Yoo ,  Sang Wuk JUN ,  Sang Kab PARK ,  Jung Soo Byun

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US20120075818A1

公开(公告)日：2012-03-29

申请号：US12972355

申请日：2010-12-17

申请人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

发明人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC分类号： H05K1/18 ,  B32B37/22

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

摘要翻译： 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US08942004B2

公开(公告)日：2015-01-27

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

发明人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

IPC分类号： H05K1/18 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US08645183B2

公开(公告)日：2014-02-04

申请号：US13110261

申请日：2011-05-18

申请人： Sung Woo Shin ,  Han Seung Lee ,  Sung Ho Tae ,  Dae Won Kim ,  Young Jun Park ,  Jung Soo Byun ,  Jang Ho An ,  Joo Ho Lee ,  Jun Seo Lee

发明人： Sung Woo Shin ,  Han Seung Lee ,  Sung Ho Tae ,  Dae Won Kim ,  Young Jun Park ,  Jung Soo Byun ,  Jang Ho An ,  Joo Ho Lee ,  Jun Seo Lee

IPC分类号： G06Q10/00

CPC分类号： G06Q10/06313 ,  Y02P90/84

摘要： The present invention relates to an environmental load assessment system, which is capable of efficiently and simply assessing an environmental load of a building in all stages (e.g., a planning stage, a design stage, a construction stage, and a use stage after construction) in doing executing a business by subdividing an assessment process, such as simple assessment in the design stage, detailed assessment in the start stage, and site assessment in the construction stage according to the progress of a construction project. The system of the present invention includes a DB server for storing material information, environmental load information, and itemized material information about a construction work and storing environmental load information about an energy source; a management server for assessing environmental loads based on simple assessment, a detailed assessment, and site assessment according to the progress of a target assessment construction project; and a UI server for providing user terminals with an execution environment so that the management server can be operated.

摘要翻译： 本发明涉及一种环境负荷评估系统，其能够在各个阶段（例如，规划阶段，设计阶段，施工阶段和施工阶段之后）有效地简单地评估建筑物的环境负荷， 根据建设项目的进展情况，在设计阶段进行简单评估，起步阶段详细评估，施工阶段现场评估等细分分析评估过程。 本发明的系统包括：DB服务器，用于存储材料信息，环境负载信息和关于建筑工作的分项材料信息，并存储关于能源的环境负载信息; 根据目标评估建设项目进展情况，简单评估，详细评估和现场评估，评估环境负荷的管理服务器; 以及用于向用户终端提供执行环境以便管理服务器可以被操作的UI服务器。

公开(公告)号：US20120160549A1

公开(公告)日：2012-06-28

申请号：US13030837

申请日：2011-02-18

申请人： Moon Il Kim ,  Yul Kyo Chung ,  Jung Soo Byun

发明人： Moon Il Kim ,  Yul Kyo Chung ,  Jung Soo Byun

IPC分类号： H05K1/09 ,  H05K3/00 ,  H05K1/16

CPC分类号： H05K3/445 ,  H01L24/24 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K1/185 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/2009 ,  H05K2203/0323 ,  H05K2203/1469 ,  Y10T29/49124 ,  H01L2924/00

摘要： Disclosed is a printed circuit board having an embedded electronic component, including a metal substrate having a first cavity formed in a thickness direction and a support plate integrated with one side of the metal substrate and formed in the first cavity. Thereby, a method of manufacturing such a printed circuit board is also provided. When manufacturing the printed circuit board having an embedded electronic component, there is no need for an additional member including support tape to seat the electronic component, thus simplifying the manufacturing process and reducing lead time, thereby improving productivity.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板，包括具有在厚度方向上形成的第一空腔的金属基板和与该金属基板的一侧成一体并形成在第一空腔中的支撑板。 因此，还提供了制造这种印刷电路板的方法。 当制造具有嵌入式电子部件的印刷电路板时，不需要包括支撑带的附加构件来安置电子部件，从而简化了制造工艺并缩短了交货时间，从而提高了生产率。

公开(公告)号：US20110314667A1

公开(公告)日：2011-12-29

申请号：US13137655

申请日：2011-08-31

申请人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

发明人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/4913

摘要： A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed

摘要翻译： 一种制造包括嵌入其中的电子部件的印刷电路板的方法，包括：准备具有形成在其中并且包括形成在其上的内部电路层的空腔的芯基板; 将带附着到所述芯基板的一侧; 将电子部件附接在带上，使得空腔在其中接收电子部件; 在所述芯基板的另一侧上形成第一绝缘层，使得所述第一绝缘层渗透到所述空腔中; 去除附着在芯基板的一侧的带，并且形成用于将电子部件的电极端子电连接到形成在芯基板的一侧上的内部电路层的连接部分; 以及在所述芯基板的一侧上形成第二绝缘层，从所述芯基板移除所述带

公开(公告)号：US08881382B2

公开(公告)日：2014-11-11

申请号：US13214009

申请日：2011-08-19

申请人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

发明人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

IPC分类号： H05K3/36 ,  H05K3/30 ,  H05K3/10 ,  H05K1/09 ,  H05K1/18 ,  H01L23/00 ,  H05K3/46

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Embodiments of the invention provide a method of manufacturing an embedded printed circuit board, which includes the following operations in the order presented: a first operation of forming a first cavity and a third cavity, disposing a first device in the first cavity and disposing a third device in the third cavity; a second operation of forming a second cavity and a fourth cavity, disposing a second device in the second cavity; a third operation of providing an insulating member; a fourth operation of disposing a first base substrate and a second base substrate and pressure laminating the first base substrate, the second base substrate, and the insulating member together; and a fifth operation of forming a first copper clad laminate and forming a second copper clad laminate.

摘要翻译： 本发明的实施例提供一种制造嵌入式印刷电路板的方法，其包括以下顺序的操作：形成第一腔和第三腔的第一操作，将第一器件设置在第一腔中，并且设置第三腔 装置在第三腔中; 形成第二腔和第四腔的第二操作，将第二装置设置在所述第二腔中; 提供绝缘构件的第三操作; 设置第一基底基板和第二基底基板并将第一基底基板，第二基底基板和绝缘部件压合在一起的第四操作; 以及形成第一覆铜层压板并形成第二覆铜层压板的第五操作。

公开(公告)号：US08339796B2

公开(公告)日：2012-12-25

申请号：US12972355

申请日：2010-12-17

申请人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

发明人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

摘要翻译： 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US20090310323A1

公开(公告)日：2009-12-17

申请号：US12222799

申请日：2008-08-15

申请人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

发明人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

IPC分类号： H05K1/14 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/4913

摘要： The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed

摘要翻译： 本发明涉及一种包括嵌入其中的电子部件的印刷电路板和使用连接部分将电子部件的电极端子与内部电路层电连接的板的制造方法，因此电路密度分散