发明授权
- 专利标题: Immobilizing device and immobilization method using the immobilization device
- 专利标题(中): 使用固定装置的固定装置和固定方法
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申请号: US13119246申请日: 2009-10-19
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公开(公告)号: US08628732B2公开(公告)日: 2014-01-14
- 发明人: Minoru Asogawa , Hayataro Kochi
- 申请人: Minoru Asogawa , Hayataro Kochi
- 申请人地址: JP Tokyo
- 专利权人: NEC Corporation
- 当前专利权人: NEC Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-268905 20081017
- 国际申请: PCT/JP2009/005459 WO 20091019
- 国际公布: WO2010/044282 WO 20100422
- 主分类号: G01N15/06
- IPC分类号: G01N15/06
摘要:
Provided is an immobilization device for fitting a connecting member of a chip and a connecting member of a cover together, where a spatial clearance between the chip and cover is small. The immobilization device includes a substrate (102), a cover means (101) including a fitting means to fit with a chip (103) placed on the substrate (102), a rotating arm means (201) rotatably joined to a first joining means (301) of the substrate (102) and to a second joining means (302) of the cover means (101), and a parallel maintaining means (203) for fitting the fitting means and the chip (103) together with the fitting means and the chip (103) maintained in substantially parallel by the first joining means (301) or the second joining means (302) moving along a chip surface or a plane parallel to the chip surface. The fitting means rotates freely against the chip (103).
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