IMMOBILIZING DEVICE AND IMMOBILIZATION METHOD USING THE IMMOBILIZATION DEVICE
    1.
    发明申请
    IMMOBILIZING DEVICE AND IMMOBILIZATION METHOD USING THE IMMOBILIZATION DEVICE 有权
    使用固定装置的固定装置和固定方法

    公开(公告)号:US20110171089A1

    公开(公告)日:2011-07-14

    申请号:US13119246

    申请日:2009-10-19

    IPC分类号: B01L9/00

    CPC分类号: G01N35/04

    摘要: Provided is an immobilization device for fitting a connecting member of a chip and a connecting member of a cover together, where a spatial clearance between the chip and cover is small. The immobilization device includes a substrate (102), a cover means (101) including a fitting means to fit with a chip (103) placed on the substrate (102), a rotating arm means (201) rotatably joined to a first joining means (301) of the substrate (102) and to a second joining means (302) of the cover means (101), and a parallel maintaining means (203) for fitting the fitting means and the chip (103) together with the fitting means and the chip (103) maintained in substantially parallel by the first joining means (301) or the second joining means (302) moving along a chip surface or a plane parallel to the chip surface. The fitting means rotates freely against the chip (103).

    摘要翻译: 提供一种用于将芯片的连接构件和盖的连接构件配合在一起的固定装置,其中芯片和盖子之间的空间间隙小。 固定装置包括基板(102),包括装配有放置在基板(102)上的芯片(103)的装配装置的盖装置(101),旋转臂装置(201),其可旋转地连接到第一连接装置 (101)的第二连接装置(302)以及用于将装配装置和芯片(103)与装配装置(103)一起装配的平行保持装置(203) 并且所述芯片(103)通过所述第一接合装置(301)或所述第二接合装置(302)基本平行地保持,所述第一接合装置沿着芯片表面或平行于所述芯片表面的平面移动。 配合装置自由地旋转于芯片(103)。

    Immobilizing device and immobilization method using the immobilization device
    2.
    发明授权
    Immobilizing device and immobilization method using the immobilization device 有权
    使用固定装置的固定装置和固定方法

    公开(公告)号:US08628732B2

    公开(公告)日:2014-01-14

    申请号:US13119246

    申请日:2009-10-19

    IPC分类号: G01N15/06

    CPC分类号: G01N35/04

    摘要: Provided is an immobilization device for fitting a connecting member of a chip and a connecting member of a cover together, where a spatial clearance between the chip and cover is small. The immobilization device includes a substrate (102), a cover means (101) including a fitting means to fit with a chip (103) placed on the substrate (102), a rotating arm means (201) rotatably joined to a first joining means (301) of the substrate (102) and to a second joining means (302) of the cover means (101), and a parallel maintaining means (203) for fitting the fitting means and the chip (103) together with the fitting means and the chip (103) maintained in substantially parallel by the first joining means (301) or the second joining means (302) moving along a chip surface or a plane parallel to the chip surface. The fitting means rotates freely against the chip (103).

    摘要翻译: 提供一种用于将芯片的连接构件和盖的连接构件配合在一起的固定装置,其中芯片和盖子之间的空间间隙小。 固定装置包括基板(102),包括装配有放置在基板(102)上的芯片(103)的装配装置的盖装置(101),旋转臂装置(201),其可旋转地连接到第一连接装置 (101)的第二连接装置(302)以及用于将装配装置和芯片(103)与装配装置(103)一起装配的平行保持装置(203) 并且所述芯片(103)通过所述第一接合装置(301)或所述第二接合装置(302)基本平行地保持,所述第一接合装置沿着芯片表面或平行于所述芯片表面的平面移动。 配合装置自由地旋转于芯片(103)。