发明授权
- 专利标题： Circuit board with high-density circuit patterns
- 专利标题（中）： 电路板采用高密度电路图案
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申请号： US13354438申请日： 2012-01-20
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公开(公告)号： US08633392B2公开(公告)日： 2014-01-21
- 发明人: Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
- 申请人： Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2006-0104203 20061025
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
摘要：
A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.
公开/授权文献
- US20120111607A1 CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS 公开/授权日：2012-05-10