发明授权
- 专利标题： Integrated circuit packaging system with leads and method of manufacturing thereof
- 专利标题（中）： 具有引线的集成电路封装系统及其制造方法
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申请号： US13327529申请日： 2011-12-15
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公开(公告)号： US08643166B2公开(公告)日： 2014-02-04
- 发明人: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- 申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/00
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead bottom body, a lead top body, and a lead top conductive layer directly on the lead top body, the lead top conductive layer having a top protrusion and a top non-vertical portion, the lead bottom body having a horizontally contiguous structure; connecting an integrated circuit to the top protrusion; and forming an encapsulation covering the integrated circuit and exposing a top non-vertical upper side of the top non-vertical portion.
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