公开(公告)号：US09059151B2

公开(公告)日：2015-06-16

申请号：US13187505

申请日：2011-07-20

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L23/495 ,  H01L21/98 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L21/4832 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an opening surrounding the upper structure, the tie bars connected to the upper structure and exposed on the base side; connecting an integrated circuit to the upper protrusions; applying an encapsulant over the integrated circuit, over the upper structure, and in the opening with the base side exposed; removing the tie bars exposing a first surface and a second surface of the encapsulant below the first surface, and forming a die paddle from the upper structure and exposed from the second surface; and removing the leadframe from the base side forming island terminals from the upper protrusions exposed from the second surface and isolated from the die paddle.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有上部结构的引线框架，上部突起和背向上部结构和上部突起的基部侧面; 在引线框架中形成带有围绕上部结构的开口的连接杆，连接杆连接到上部结构并在基部侧露出; 将集成电路连接到上突起; 在所述集成电路上，在所述上部结构上以及在所述开口中施加密封剂，所述基部侧露出; 去除所述连接杆，将所述密封剂的第一表面和第二表面暴露在所述第一表面下方，以及从所述上部结构形成模片并从所述第二表面露出; 以及从所述基座侧移除所述引线框架，所述引线框架从形成岛端子的所述上突出部暴露于所述第二表面并与所述管芯焊盘隔离。

公开(公告)号：US08803300B2

公开(公告)日：2014-08-12

申请号：US12889911

申请日：2010-09-24

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成具有管芯连接板和通过连接件连接的接触焊盘的引线框架; 在芯片附接板上安装集成电路管芯; 在所述引线框架和所述集成电路管芯上形成封装主体，所述封装主体包括从所述封装主体露出的所述管芯附接板，所述接触焊盘和所述连接部分的部分; 通过蚀刻掉接触垫和管芯附接板之间的连接来形成暴露的边缘; 以及在暴露的边缘上沉积耐焊层。

公开(公告)号：US08604596B2

公开(公告)日：2013-12-10

申请号：US13071433

申请日：2011-03-24

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/495

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2224/45099

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a hole, a lead extension, and an exterior pad under the lead extension with the hole abutting the lead extension; connecting an electrical interconnect between an integrated circuit and the lead extension; forming an encapsulation over the integrated circuit and surrounding the electrical interconnect and through the hole; and removing a bottom portion of the lead frame resulting in a stand-off lead from the lead extension with the exterior pad on the stand-off lead.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有孔，引线延伸部和引线延伸部下方的外部焊盘的引线框架，所述孔邻接所述引线延伸部; 连接集成电路和引线延伸部之间的电互连; 在集成电路上形成封装并围绕电互连并穿过孔; 并且移除引线框架的底部部分，从而使引线延伸部处于与支撑引线上的外部焊盘相对的间隔引线。

公开(公告)号：US08404524B2

公开(公告)日：2013-03-26

申请号：US12884073

申请日：2010-09-16

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L21/00

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a hole, a recess, and a pad, the hole over the recess; mounting an integrated circuit to the package paddle; forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle; attaching connectors directly on the integrated circuit, the lead, and the package paddle; and forming an encapsulation covering the integrated circuit and within the hole and the recess.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有孔，凹槽和垫的封装桨，该凹槽上方的孔; 将集成电路安装到封装焊盘上; 形成具有与所述垫的底表面共面的底表面的引线，所述引线与所述封装焊盘隔离; 将连接器直接连接在集成电路，引线和封装焊盘上; 以及形成覆盖所述集成电路并且在所述孔和所述凹部内的封装。

公开(公告)号：US08241965B2

公开(公告)日：2012-08-14

申请号：US12859049

申请日：2010-08-18

申请人： Henry Descalzo Bathan ,  Flynn Carson ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

发明人： Henry Descalzo Bathan ,  Flynn Carson ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

IPC分类号： H01L21/00

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle; forming a pad extension having a spacing to the package paddle; forming a lead adjacent the pad extension, the pad extension between the package paddle and the lead; forming a conductive layer directly on and between the package paddle and the pad extension; and connecting an integrated circuit to the pad extension and the lead, the integrated circuit over the package paddle.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供封装焊盘; 形成具有到所述包装桨的间隔的垫延伸部; 在所述焊盘延伸部附近形成引线，所述焊盘在所述封装焊盘和引线之间延伸; 直接在封装焊盘和焊盘延伸部之间形成导电层; 并将集成电路连接到焊盘扩展部分和引线，封装焊盘上的集成电路。

公开(公告)号：US08203201B2

公开(公告)日：2012-06-19

申请号：US12732465

申请日：2010-03-26

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a paddle, an inner post adjacent to the paddle, a jumper pad, and an outer post, with the jumper pad between the inner post and the outer post; mounting an integrated circuit over a paddle first side, the paddle first side co-planar with the outer post; connecting a first jumper interconnect between the integrated circuit and the jumper pad; connecting a second jumper interconnect between the jumper pad and the outer post; and forming an encapsulation over paddle, the integrated circuit, the first jumper interconnect, the jumper pad, and the second jumper interconnect.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成桨，邻近桨的内柱，跳针垫和外柱，其中跨接垫位于内柱和外柱之间; 将集成电路安装在桨叶第一侧上，所述桨叶第一侧与所述外柱共面; 连接集成电路和跳线焊盘之间的第一跳线互连; 在跳线焊盘和外部柱之间连接第二跳线互连; 以及在焊盘，集成电路，第一跳线互连，跳线焊盘和第二跳线互连之间形成封装。

公开(公告)号：US20140048919A1

公开(公告)日：2014-02-20

申请号：US13586178

申请日：2012-08-15

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/49 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an array of leads having a jumper lead and a covered contact; coupling an insulated bonding wire between the jumper lead and the covered contact; attaching an integrated circuit die over the covered contact; and coupling a bond wire between the integrated circuit die and the jumper lead including coupling the integrated circuit die to the covered contact through the insulated bonding wire.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有跳线和覆盖触点的引线阵列; 将绝缘接合线耦合在跳线和覆盖触点之间; 将集成电路管芯覆盖在覆盖的触点上; 并且在所述集成电路管芯和所述跨接引线之间耦合接合线，包括通过所述绝缘接合线将所述集成电路管芯连接到所述覆盖接触点。

公开(公告)号：US08617933B2

公开(公告)日：2013-12-31

申请号：US13118214

申请日：2011-05-27

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Dioscoro A. Merilo

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Dioscoro A. Merilo

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead overhang at an obtuse angle to a lead top side and having a lead ridge protruding from a lead non-horizontal side, the lead overhang having a lead overhang-undercut side at an acute angle to a lead overhang non-horizontal side; forming a lead conductive cap completely covering the lead overhang non-horizontal side and the lead top side; forming a package paddle adjacent the lead; mounting an integrated circuit over the package paddle; and forming an encapsulation over the integrated circuit, the package paddle, and the lead.

摘要翻译： 一种集成电路封装系统的制造方法，其特征在于，具有：引线，其具有与铅顶侧成钝角的引线突出部，并且具有从引线非水平侧突出的引线突起，所述引线突出部具有引线突出端， 底切侧与突出的非水平侧成锐角; 形成完全覆盖所述引线伸出非水平侧和所述引线顶侧的导电帽; 形成邻近引线的封装焊盘; 在封装桨上安装集成电路; 以及在集成电路，封装焊盘和引线上形成封装。

公开(公告)号：US08508026B2

公开(公告)日：2013-08-13

申请号：US12957361

申请日：2010-11-30

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/28 ,  H01L23/52

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad; forming a support structure between the inner pad and the outer pad; mounting an integrated circuit device over the component pad; attaching an interconnect to the integrated circuit device and the outer pad, the interconnect above the inner pad and supported by the support structure; and applying an encapsulation over the connection structure, the interconnect, and the integrated circuit device.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有部件焊盘，外部焊盘和内部焊盘的连接结构，所述内部焊盘在所述部件焊盘和所述外部焊盘之间; 在所述内垫和所述外垫之间形成支撑结构; 在组件垫上安装集成电路器件; 将互连件附接到集成电路器件和外部焊盘，在内部焊盘上方的互连并由支撑结构支撑; 以及在连接结构，互连和集成电路器件上施加封装。

公开(公告)号：US08455993B2

公开(公告)日：2013-06-04

申请号：US12789077

申请日：2010-05-27

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L23/482

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a first lead adjacent and staggered to a second lead, the first lead having a first external connection portion with a first external conductive layer and a first internal connection portion, the first external connection portion oriented laterally outwards from the first internal connection portion, and the second lead having a second external connection portion with a second external conductive layer and a second internal connection portion; connecting an integrated circuit device with the first internal connection portion and with the second internal connection portion; forming an encapsulation over the integrated circuit device with the first lead and the second lead exposed; and forming a solder mask on the encapsulation, on the first lead, and on the second lead with the first external conductive layer and the second external conductive layer exposed from the solder mask.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成与第二引线相邻并交错的第一引线，所述第一引线具有第一外部连接部分，其具有第一外部导电层和第一内部连接部分，所述第一外部连接 所述第二引线具有第二外部连接部分，所述第二外部连接部分具有第二外部导电层和第二内部连接部分;第二外部连接部分， 将集成电路装置与第一内部连接部分和第二内部连接部分连接; 在所述集成电路器件上形成封装，所述第一引线和所述第二引线暴露; 以及在第一引线和第二引线上的封装，第一外部导电层和第二外部导电层从焊料掩模露出的上形成焊料掩模。