发明授权
- 专利标题： Wafer level packaging bond
- 专利标题（中）： 晶圆级包装贴
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申请号： US12729911申请日： 2010-03-23
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公开(公告)号： US08647962B2公开(公告)日： 2014-02-11
- 发明人: Martin Liu , Richard Chu , Hung Hua Lin , Hsin-Ting Huang , Jung-Huei Peng , Yuan-Chih Hsieh , Lan-Lin Chao , Chun-Wen Cheng , Chia-Shiung Tsai
- 申请人： Martin Liu , Richard Chu , Hung Hua Lin , Hsin-Ting Huang , Jung-Huei Peng , Yuan-Chih Hsieh , Lan-Lin Chao , Chun-Wen Cheng , Chia-Shiung Tsai
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/00 ; H01L21/46 ; H01L21/76
摘要：
The present disclosure provides a method of bonding a plurality of substrates. In an embodiment, a first substrate includes a first bonding layer. The second substrate includes a second bonding layer. The first bonding layer includes silicon; the second bonding layer includes aluminum. The first substrate and the second substrate are bonded forming a bond region having an interface between the first bonding layer and the second bonding layer. A device having a bonding region between substrates is also provided. The bonding region includes an interface between a layer including silicon and a layer including aluminum.
公开/授权文献
- US20110233621A1 Wafer Level Packaging Bond 公开/授权日：2011-09-29
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