Invention Grant
- Patent Title: Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture
- Patent Title (中): 紧凑的热控薄膜电阻器，利用基板触点和制造方法
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Application No.: US13008459Application Date: 2011-01-18
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Publication No.: US08652922B2Publication Date: 2014-02-18
- Inventor: Joseph M. Lukaitis , Jed H. Rankin , Robert R. Robison , Dustin K. Slisher , Timothy D. Sullivan
- Applicant: Joseph M. Lukaitis , Jed H. Rankin , Robert R. Robison , Dustin K. Slisher , Timothy D. Sullivan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David Cain
- Main IPC: H01L21/20
- IPC: H01L21/20
Abstract:
A method of forming a semiconductor structure includes forming a resistor on an insulator layer over a substrate and forming a trench in the resistor and into the substrate. The method also includes forming a liner on sidewalls of the trench and forming a core comprising a high thermal conductivity material in the trench and on the liner.
Public/Granted literature
- US20120181663A1 COMPACT THERMALLY CONTROLLED THIN FILM RESISTORS UTILIZING SUBSTRATE CONTACTS AND METHODS OF MANUFACTURE Public/Granted day:2012-07-19
Information query
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