Invention Grant
US08663804B2 Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
有权
由包含二异氰酸酯的粘合层压板包封的印刷线路板及其制备方法
- Patent Title: Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
- Patent Title (中): 由包含二异氰酸酯的粘合层压板包封的印刷线路板及其制备方法
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Application No.: US13168069Application Date: 2011-06-24
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Publication No.: US08663804B2Publication Date: 2014-03-04
- Inventor: George Elias Zahr
- Applicant: George Elias Zahr
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B32B27/38
- IPC: B32B27/38 ; C07D293/10 ; C07D251/00 ; C08L63/00 ; C08K9/00
Abstract:
The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing.
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