发明授权
US08664699B2 Methods and devices for fabricating and assembling printable semiconductor elements
有权
用于制造和组装可印刷半导体元件的方法和装置
- 专利标题： Methods and devices for fabricating and assembling printable semiconductor elements
- 专利标题（中）： 用于制造和组装可印刷半导体元件的方法和装置
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申请号： US13801868申请日： 2013-03-13
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公开(公告)号： US08664699B2公开(公告)日： 2014-03-04
- 发明人: Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
- 申请人： The Board of Trustees of the University of Illinois
- 申请人地址： US IL Urbana
- 专利权人： The Board of Trustees of the University of Illinois
- 当前专利权人： The Board of Trustees of the University of Illinois
- 当前专利权人地址： US IL Urbana
- 代理机构： Lathrop & Gage LLP
- 主分类号： H01L29/76
- IPC分类号： H01L29/76 ; H01L21/70 ; H01L21/20 ; H01L21/36 ; C23C16/54
摘要：
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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