专利检索 ap:("The Board of Trustees of the University of Illinois") AND inv:"Yugang Sun" 第 1 页

1.

发明授权
Methods and devices for fabricating and assembling printable semiconductor elements 有权

公开(公告)号：US10374072B2

公开(公告)日：2019-08-06

申请号：US15640206

申请日：2017-06-30

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu

IPC分类号： H01L29/76 , H01L21/322 , H01L23/02 , B82Y10/00 , H01L29/06 , H01L29/786 , H01L31/0392 , H01L31/18 , H01L21/02 , H01L21/308 , H01L29/12 , H01L29/04 , H01L23/00 , H01L21/683 , H01L27/12 , H01L25/075 , H01L33/00 , H01L33/32

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

2.

发明授权
Methods and devices for fabricating and assembling printable semiconductor elements 有权

公开(公告)号：US09450043B2

公开(公告)日：2016-09-20

申请号：US14155010

申请日：2014-01-14

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu

IPC分类号： H01L29/06 , B82Y10/00 , H01L31/0392 , H01L31/18 , H01L21/02 , H01L21/308 , H01L29/12 , H01L29/04 , H01L23/00 , H01L21/683 , H01L27/12 , H01L29/786

CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

3.

发明授权
Methods and devices for fabricating and assembling printable semiconductor elements 有权

公开(公告)号：US12074213B2

公开(公告)日：2024-08-27

申请号：US17357697

申请日：2021-06-24

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu

IPC分类号： H01L29/76 , B82Y10/00 , H01L21/02 , H01L21/308 , H01L21/322 , H01L21/683 , H01L23/00 , H01L23/02 , H01L25/075 , H01L27/12 , H01L29/04 , H01L29/06 , H01L29/12 , H01L29/786 , H01L31/0392 , H01L31/18 , H01L33/00 , H01L33/32

CPC分类号： H01L29/76 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/80 , H01L24/83 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0093 , H01L33/32 , B81C2201/0185 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/94 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/50 , Y10S977/707 , Y10S977/724 , H01L2224/05644 , H01L2924/00014 , H01L2224/05124 , H01L2924/00014 , H01L2224/0332 , H01L2924/00014 , H01L2224/97 , H01L2224/80 , H01L2224/97 , H01L2224/83 , H01L2224/80121 , H01L2924/00012 , H01L2224/83121 , H01L2924/00012 , H01L2224/9202 , H01L2224/03 , H01L2224/05666 , H01L2924/00014 , H01L2224/2919 , H01L2924/0665 , H01L2224/94 , H01L2224/03 , H01L2224/05155 , H01L2924/00014 , H01L2224/05144 , H01L2924/01032 , H01L2224/05082 , H01L2224/05644 , H01L2224/05155 , H01L2224/05144 , H01L2924/01032 , H01L2224/05073 , H01L2224/05644 , H01L2224/05166 , H01L2224/05166 , H01L2924/00014 , H01L2224/05555 , H01L2924/00014 , H01L2224/05554 , H01L2924/00014 , H01L2224/05553 , H01L2924/00014 , H01L2224/05552 , H01L2924/00012 , H01L2224/83192 , H01L2224/32225 , H01L2924/00 , H01L2924/13091 , H01L2924/00 , H01L2924/1306 , H01L2924/00 , H01L2924/1461 , H01L2924/00 , H01L2924/1305 , H01L2924/00 , H01L2924/12032 , H01L2924/00 , H01L2924/15788 , H01L2924/00 , H01L2924/12036 , H01L2924/00 , H01L2924/12042 , H01L2924/00 , H01L2924/12043 , H01L2924/00 , H01L2924/12044 , H01L2924/00 , H01L2924/13063 , H01L2924/00 , H01L2924/14 , H01L2924/00 , H01L2924/13055 , H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

4.

发明授权
Stretchable form of single crystal silicon for high performance electronics on rubber substrates 有权

公开(公告)号：US10204864B2

公开(公告)日：2019-02-12

申请号：US15339338

申请日：2016-10-31

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers , Dahl-Young Khang , Yugang Sun , Etienne Menard

IPC分类号： H01L23/538 , H01L23/00 , H01L29/786 , H01L23/31 , H05K1/02

摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

5.

发明授权
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics 有权
标题翻译：半导体互连中的受控弯曲结构和用于可拉伸电子学的纳米膜

公开(公告)号：US09324733B2

公开(公告)日：2016-04-26

申请号：US14220910

申请日：2014-03-20

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers , Matthew Meitl , Yugang Sun , Heung Cho Ko , Andrew Carlson , Won Mook Choi , Mark Stoykovich , Hanqing Jiang , Yonggang Huang , Ralph G. Nuzzo , Zhengtao Zhu , Etienne Menard , Dahl-Young Khang

IPC分类号： H01L29/12 , H01L27/12 , H01L21/8258 , H05K1/02 , H01L21/02 , H01L29/06 , H05K3/20

CPC分类号： H01L29/72 , H01L21/02422 , H01L21/02628 , H01L21/4846 , H01L21/8258 , H01L23/5387 , H01L27/12 , H01L29/0657 , H01L2924/12041 , H01L2924/13091 , H05K1/0283 , H05K3/20 , H05K3/22 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00

摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

摘要翻译： 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

6.

发明授权
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics 有权

公开(公告)号：US10355113B2

公开(公告)日：2019-07-16

申请号：US15084112

申请日：2016-03-29

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers , Matthew Meitl , Yugang Sun , Heung Cho Ko , Andrew Carlson , Won Mook Choi , Mark Stoykovich , Hanqing Jiang , Yonggang Huang , Ralph G. Nuzzo , Zhengtao Zhu , Etienne Menard , Dahl-Young Khang

IPC分类号： H05K3/30 , H01L29/72 , H01L21/8258 , H05K1/02 , H01L21/02 , H01L27/12 , H01L29/06 , H01L21/48 , H01L23/538 , H05K3/22 , H05K3/20

摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

7.

发明授权
Methods and devices for fabricating and assembling printable semiconductor elements 有权

公开(公告)号：US09761444B2

公开(公告)日：2017-09-12

申请号：US15084091

申请日：2016-03-29

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu

IPC分类号： H01L21/02 , B82Y10/00 , H01L29/06 , H01L29/786 , H01L31/0392 , H01L31/18 , H01L21/308 , H01L29/12 , H01L29/04 , H01L23/00 , H01L21/683 , H01L27/12 , H01L25/075 , H01L33/00 , H01L33/32

CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

8.

发明授权
Methods and devices for fabricating and assembling printable semiconductor elements 有权
标题翻译：用于制造和组装可印刷半导体元件的方法和装置

公开(公告)号：US08664699B2

公开(公告)日：2014-03-04

申请号：US13801868

申请日：2013-03-13

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu

IPC分类号： H01L29/76 , H01L21/70 , H01L21/20 , H01L21/36 , C23C16/54

CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

9.

发明授权
Methods and devices for fabricating and assembling printable semiconductor elements 有权

公开(公告)号：US11088268B2

公开(公告)日：2021-08-10

申请号：US16448988

申请日：2019-06-21

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu

IPC分类号： H01L29/76 , H01L21/322 , H01L23/02 , H01L31/0392 , H01L31/18 , H01L23/00 , H01L21/683 , H01L27/12 , H01L21/02 , B82Y10/00 , H01L29/06 , H01L29/786 , H01L33/00 , H01L21/308 , H01L29/12 , H01L29/04 , H01L25/075 , H01L33/32

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.