发明授权
- 专利标题： Method of assembling two integrated circuits and corresponding structure
- 专利标题（中）： 组装两个集成电路及相应结构的方法
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申请号： US13328175申请日： 2011-12-16
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公开(公告)号： US08674517B2公开(公告)日： 2014-03-18
- 发明人: Laurent-Luc Chapelon , Mohamed Bouchoucha
- 申请人： Laurent-Luc Chapelon , Mohamed Bouchoucha
- 申请人地址： FR Crolles
- 专利权人： STMicroelectronics (Crolles 2) SAS
- 当前专利权人： STMicroelectronics (Crolles 2) SAS
- 当前专利权人地址： FR Crolles
- 代理机构： Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- 优先权： FR1060637 20101216
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/50
摘要：
A semiconductor device includes an assembly of two integrated circuits. The assembly has a layer of photoresist filling the space between the two integrated circuits, and at least one electrically conducting pillar within the resist and electrically coupling the two integrated circuits.
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