发明授权
US08682466B2 Automatic virtual metrology for semiconductor wafer result prediction
有权
自动虚拟测量用于半导体晶圆结果预测
- 专利标题： Automatic virtual metrology for semiconductor wafer result prediction
- 专利标题（中）： 自动虚拟测量用于半导体晶圆结果预测
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申请号： US12025933申请日： 2008-02-05
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公开(公告)号： US08682466B2公开(公告)日： 2014-03-25
- 发明人: Francis Ko , Chih-Wei Lai , Kewei Zuo , Henry Lo , Jean Wang , Ping-Hsu Chen , Chun-Hsien Lim , Chen-Hua Yu
- 申请人： Francis Ko , Chih-Wei Lai , Kewei Zuo , Henry Lo , Jean Wang , Ping-Hsu Chen , Chun-Hsien Lim , Chen-Hua Yu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： G06F17/50
- IPC分类号： G06F17/50
摘要：
A method to enable wafer result prediction includes collecting manufacturing data from various semiconductor manufacturing tools and metrology tools; choosing key parameters using an autokey method based on the manufacturing data; building a virtual metrology based on the key parameters; and predicting wafer results using the virtual metrology.
公开/授权文献
- US20080275586A1 Novel Methodology To Realize Automatic Virtual Metrology 公开/授权日：2008-11-06
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