发明授权
- 专利标题: Printed wiring board and method for manufacturing the same
- 专利标题(中): 印刷电路板及其制造方法
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申请号: US12606546申请日: 2009-10-27
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公开(公告)号: US08686300B2公开(公告)日: 2014-04-01
- 发明人: Satoru Kawai , Kenji Sakai , Liyi Chen
- 申请人: Satoru Kawai , Kenji Sakai , Liyi Chen
- 申请人地址: JP Ogaki-shi
- 专利权人: Ibiden Co., Ltd.
- 当前专利权人: Ibiden Co., Ltd.
- 当前专利权人地址: JP Ogaki-shi
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 主分类号: H05K1/11
- IPC分类号: H05K1/11
摘要:
A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.