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    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    2.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
    印刷线路板和制造印刷线路板的方法

    公开(公告)号：US20120061347A1

    公开(公告)日：2012-03-15

    申请号：US13273335

    申请日：2011-10-14

    申请人： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

    发明人： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

    摘要翻译： 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

    Method for manufacturing a printed wiring board
    4.
    发明授权
    Method for manufacturing a printed wiring board 有权
    印刷电路板的制造方法

    公开(公告)号：US08418360B2

    公开(公告)日：2013-04-16

    申请号：US13273335

    申请日：2011-10-14

    申请人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    发明人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    IPC分类号： H05K3/02

    CPC分类号： H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

    摘要翻译： 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

    Inverse level shift circuit
    9.
    发明授权
    Inverse level shift circuit 有权
    反电平移位电路

    公开(公告)号：US08779830B2

    公开(公告)日：2014-07-15

    申请号：US13802576

    申请日：2013-03-13

    申请人： Takaki Nakashima ,  Motoki Imanishi ,  Kenji Sakai

    发明人： Takaki Nakashima ,  Motoki Imanishi ,  Kenji Sakai

    IPC分类号： H03L5/00

    CPC分类号： H03K17/063 ,  H03K2217/0063

    摘要： A voltage conversion mask signal generation circuit generates a first main signal and a first mask signal by converting an output signal of the first transistor to a low-side voltage, and generating a second main signal and a second mask signal by converting an output signal of the second transistor to a low-side voltage. A mask signal generation circuit generating a third mask signal with higher sensitivity than the first and second mask signals with respect to a fluctuation in the high-side reference potential. A mask logical circuit generating a fourth mask signal by performing a AND operation between the first mask signal and the second mask signal, and masking the first and second main signals with the third and fourth mask signals; and a SR flip flop circuit generating the output signal from the masked first and second main signals.

    摘要翻译： 电压转换掩模信号产生电路通过将第一晶体管的输出信号转换为低侧电压来产生第一主信号和第一屏蔽信号，并且通过将第一主信号和第二屏蔽信号的输出信号 第二晶体管为低端电压。 掩模信号生成电路相对于高侧基准电位的波动产生比第一和第二掩模信号高的灵敏度的第三掩模信号。 一种掩模逻辑电路，通过在第一屏蔽信号和第二屏蔽信号之间执行“与”运算，并用第三和第四屏蔽信号屏蔽第一和第二主信号来产生第四屏蔽信号; 以及SR触发器电路，从被掩蔽的第一和第二主信号产生输出信号。

    Power semiconductor device including a bootstrap compensation circuit
    10.
    发明授权
    Power semiconductor device including a bootstrap compensation circuit 有权
    功率半导体器件，包括自举补偿电路

    公开(公告)号：US08724357B2

    公开(公告)日：2014-05-13

    申请号：US13010178

    申请日：2011-01-20

    申请人： Motoki Imanishi ,  Kenji Sakai ,  Yoshikazu Tanaka

    发明人： Motoki Imanishi ,  Kenji Sakai ,  Yoshikazu Tanaka

    IPC分类号： H02M7/5387 ,  H02M1/084

    CPC分类号： H02M1/08 ,  H03K17/063

    摘要： A power semiconductor device comprises: high side and low side switching elements; high side and low side drive circuits; a bootstrap capacitor supplying a drive voltage to the high side drive circuit and having a first terminal connected to a connection point between the high side switching element and the low side switching element and a second terminal connected to a power supply terminal of the high side drive circuit; a bootstrap diode having an anode connected to a power supply and a cathode connected to the second terminal and supplying a current from the power supply to the second terminal; a floating power supply; and a bootstrap compensation circuit supplying a current from the floating power supply to the second terminal, when the high side drive circuit turns ON the high side switching element and the low side drive circuit turns OFF the low side switching element.

    摘要翻译： 功率半导体器件包括：高侧和低侧开关元件; 高侧和低侧驱动电路; 向高侧驱动电路供给驱动电压并具有与高侧开关元件和低侧开关元件之间的连接点连接的第一端子的自举电容器和连接到高侧驱动器的电源端子的第二端子 电路 引导二极管，其具有连接到电源的阳极和连接到第二端子的阴极，并且将电流从电源提供给第二端子; 浮动电源; 以及当所述高侧驱动电路导通所述高侧开关元件并且所述低侧驱动电路使所述低侧开关元件断开时，从所述浮动电源向所述第二端子供给电流的自举补偿电路。