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    Method for manufacturing a printed wiring board
    3.
    发明授权
    Method for manufacturing a printed wiring board 有权
    印刷电路板的制造方法

    公开(公告)号：US08418360B2

    公开(公告)日：2013-04-16

    申请号：US13273335

    申请日：2011-10-14

    申请人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    发明人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    IPC分类号： H05K3/02

    CPC分类号： H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

    摘要翻译： 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

    Method for manufacturing printed wiring board
    5.
    发明授权
    Method for manufacturing printed wiring board 有权
    印刷电路板制造方法

    公开(公告)号：US09078343B2

    公开(公告)日：2015-07-07

    申请号：US13325105

    申请日：2011-12-14

    申请人： Tsutomo Yamauchi ,  Satoru Kawai

    发明人： Tsutomo Yamauchi ,  Satoru Kawai

    IPC分类号： H05K3/00 ,  H05K3/46

    CPC分类号： H05K3/0032 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572

    摘要： A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening.

    摘要翻译： 一种制造印刷线路板的方法，包括在芯基板中形成贯通孔，在基板的第一表面上形成第一导体，在基板的第二表面上形成第二导体，并在该孔中填充导电材料 使得在孔中形成通孔导体，并且第一和第二导体经由通孔导体连接。 孔的形成包括在第一表面中形成第一开口，从第一开口的底部朝向第二表面形成第二开口，使得第二开口具有比第一开口更小的直径，在第二开口中形成第三开口 并且从第三开口的底部朝向第一表面形成第四开口，使得第四开口具有比第三开口小的直径。

    PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
    6.
    发明申请
    PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
    电镀设备，镀层方法和多层印刷电路板

    公开(公告)号：US20120005888A1

    公开(公告)日：2012-01-12

    申请号：US13240626

    申请日：2011-09-22

    申请人： Toru Nakai ,  Satoru Kawai ,  Hiroshi Niwa ,  Yoshiyuki Iwata

    发明人： Toru Nakai ,  Satoru Kawai ,  Hiroshi Niwa ,  Yoshiyuki Iwata

    IPC分类号： H05K3/00

    CPC分类号： C25D5/02 ,  H05K3/108 ,  H05K3/421 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4661 ,  H05K2201/0116 ,  H05K2201/09563 ,  H05K2203/025 ,  H05K2203/0257 ,  Y10T29/49124 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/249955 ,  Y10T428/249958

    摘要： A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.

    摘要翻译： 一种多层印刷电路板的制造方法，其特征在于，具有提供具有贯通孔的芯基板，在所述基板的表面上形成无电镀膜和所述贯通孔的内壁面，对所述基板进行电解电镀，同时相对于 在所述基板的表面上与所述基板的表面接触的绝缘构件，使得在所述无电镀膜上形成电解电镀膜，所述贯通孔内的开口空间填充有电解材料， 在导电孔中形成空穴导体结构，在电解镀膜上形成具有开口图案的抗蚀剂，并且除去由开口图案露出的电解电镀膜的露出图案，以及将化学镀膜的图案 使得在基板的表面上形成导体电路。

    Medical image forming method, forming apparatus of the same, and thermal transfer sheet of the same
    8.
    发明授权
    Medical image forming method, forming apparatus of the same, and thermal transfer sheet of the same 失效
    医用图像形成方法，其形成装置及其热转印片

    公开(公告)号：US5354725A

    公开(公告)日：1994-10-11

    申请号：US983167

    申请日：1992-11-30

    申请人： Hiroshi Eguchi ,  Minoru Furuse ,  Satoru Kawai

    发明人： Hiroshi Eguchi ,  Minoru Furuse ,  Satoru Kawai

    IPC分类号： A61B1/04 ,  B41M5/34 ,  B41M5/382 ,  B41M5/41 ,  B41M5/035 ,  B41M5/38

    CPC分类号： B41M5/345 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24942 ,  Y10T428/273

    摘要： A medical image forming method including the steps of superposing a three-primary-color thermal transfer sheet and an image receiving sheet, the thermal transfer sheet having a base film and three color dye layers of yellow, magenta, and cyan, each of the dye layer being composed of a dye and a binder, the image receiving sheet having a dye accepting layer; heating the rear surface of the thermal transfer sheet with a heating device in an image shape; and driving and controlling the heating device with a control unit so as to form a full color image on the image receiving sheet. The control unit is adapted to compensate tones of the image so that chromaticity values thereof formed on the image receiving sheet are in a region defined by four points of (a*=0, b*=0), (a*=20, b*=-5), (a*=18, b*=15), and (a*=0, b*=15) when an achromatic color signal is input and L*=80. According to an aspect of the present invention, the control unit is adapted to compensate tones of three primary colors so that the density graduation of light red of an image in accordance with a light red signal sent to the control unit becomes high and thereby the low density region (light region) of the image formed in accordance with a achromatic color signal becomes reddish. According to another aspect of the present invention, since the dye layers are formed so that the light region becomes reddish and the dark region greenish, images where colors from light orange to light red can be easily distinguished are formed.

    摘要翻译： 一种医学图像形成方法，包括以下步骤：叠加三原色热转印片和图像接收片，所述热转印片具有基膜和黄色，品红色和青色的三色染料层，每种染料 该层由染料和粘合剂组成，图像接收片具有染料接收层; 用图像形状的加热装置加热热转印片的后表面; 以及通过控制单元驱动和控制加热装置，以在图像接收片材上形成全色图像。 控制单元适于补偿图像的色调，使得在图像接收片上形成的色度值位于由（a * = 0，b * = 0），（a * = 20，b * = - 5），（a * = 18，b * = 15）和（a * = 0，b * = 15）时，输入无彩色信号，L * = 80。 根据本发明的一个方面，控制单元适用于补偿三原色的色调，使得根据发送到控制单元的浅红色信号的图像的红色的浓度刻度变高，从而低 根据无彩色信号形成的图像的浓度区域（光区域）变得微红。 根据本发明的另一方面，由于形成染色层，所以能够容易地区分出从浅橙色到浅红色的颜色的区域变得浅红色，暗区域变绿。

    Printed wiring board and method for manufacturing printed wiring board
    9.
    发明授权
    Printed wiring board and method for manufacturing printed wiring board 有权
    印刷电路板及制造印刷线路板的方法

    公开(公告)号：US08552312B2

    公开(公告)日：2013-10-08

    申请号：US12944813

    申请日：2010-11-12

    申请人： Satoru Kawai ,  Yasuki Kimishima

    发明人： Satoru Kawai ,  Yasuki Kimishima

    IPC分类号： H05K1/11

    CPC分类号： H05K3/423 ,  H05K3/427 ,  H05K2201/0959 ,  H05K2203/1476

    摘要： A printed wiring board including a substrate having first and second surfaces and a penetrating hole extending through the substrate between the surfaces, a first conductive circuit on the first surface, a second conductive circuit on the second surface, and a through-hole conductor in the hole and connecting the first and second conductive circuits. The conductor includes an electroless plated film on the inner-wall surface of the hole, a first electrolytic plated film formed on the electroless plated film and forming a first opening portion opening on the first surface and a second opening portion opening on the second surface, a second electrolytic plated film filling the first portion, and a third electrolytic plated film filling the second portion. The first and second portions taper toward the central portion of the hole with respect to the axis direction of the hole and have cross sections forming a substantially U-shape, respectively.

    摘要翻译： 一种印刷电路板，包括具有第一表面和第二表面的基底和在表面之间延伸穿过基底的穿透孔，第一表面上的第一导电电路，第二表面上的第二导电电路和第二表面上的通孔导体 并连接第一和第二导电电路。 所述导体在所述孔的内壁面上具有无电解电镀膜，形成在所述无电解电镀膜上的第一电解电镀膜，在所述第一面上形成开口部的开口部，在所述第二面上开设第二开口部， 填充第一部分的第二电解电镀膜和填充第二部分的第三电解电镀膜。 第一和第二部分相对于孔的轴线方向朝向孔的中心部分逐渐变细，并且分别形成大致U形的横截面。

    Method of manufacturing double-sided circuit board
    10.
    发明授权
    Method of manufacturing double-sided circuit board 有权
    制造双面电路板的方法

    公开(公告)号：US08413324B2

    公开(公告)日：2013-04-09

    申请号：US12757157

    申请日：2010-04-09

    申请人： Kota Noda ,  Tsutomu Yamauchi ,  Satoru Kawai

    发明人： Kota Noda ,  Tsutomu Yamauchi ,  Satoru Kawai

    IPC分类号： H01K3/10

    CPC分类号： H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09254 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166

    摘要： A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R1 on the first surface of the substrate, forming a second hole having a second opening with a diameter R2 on the second surface of the substrate, forming a third hole having a diameter smaller than R1 and/or R2 and connecting the first and second holes such that a penetrating hole formed of the first hole, the second hole and the third hole is formed in the substrate, forming a first conductive circuit on the first surface of the substrate, forming a second conductive circuit on the second surface of the substrate, and filling the penetrating hole with conductive material such that a through-hole conductor electrically connecting the first conductive circuit and the second conductive circuit is formed.

    摘要翻译： 一种制造双面电路板的方法包括制备具有第一和第二表面的基板，在基板的第一表面上形成具有直径为R1的第一开口的第一孔，形成具有第二开口的第二孔， 在所述基板的第二表面上的直径R2，形成直径小于R1和/或R2的第三孔，并且连接所述第一孔和所述第二孔，使得由所述第一孔，所述第二孔和所述第三孔形成的穿透孔 形成在基板上，在基板的第一表面上形成第一导电电路，在基板的第二表面上形成第二导电电路，并用导电材料填充该贯穿孔，使得通孔导体将 形成第一导电电路和第二导电电路。