发明授权
- 专利标题: Method for removing material from semiconductor wafer and apparatus for performing the same
- 专利标题(中): 从半导体晶片去除材料的方法及其执行方法
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申请号: US13670305申请日: 2012-11-06
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公开(公告)号: US08691027B2公开(公告)日: 2014-04-08
- 发明人: Mikhail Korolik , Michael Ravkin , John de Larios , Fritz C. Redeker , John M. Boyd
- 申请人: Mikhail Korolik , Michael Ravkin , John de Larios , Fritz C. Redeker , John M. Boyd
- 申请人地址: US CA Fremont
- 专利权人: Lam Research Corporation
- 当前专利权人: Lam Research Corporation
- 当前专利权人地址: US CA Fremont
- 代理机构: Martine Penilla Group, LLP
- 主分类号: B08B3/00
- IPC分类号: B08B3/00 ; B08B7/00 ; B08B7/04 ; H01L21/67
摘要:
A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non-Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer.
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