Invention Grant
- Patent Title: Substrate treatment method and substrate treatment system
- Patent Title (中): 底物处理方法和底物处理系统
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Application No.: US12733614Application Date: 2008-08-21
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Publication No.: US08731701B2Publication Date: 2014-05-20
- Inventor: Wataru Tsukinoki , Yuichi Yamamoto
- Applicant: Wataru Tsukinoki , Yuichi Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2007-243457 20070920; JP2008-153422 20080611
- International Application: PCT/JP2008/064913 WO 20080821
- International Announcement: WO2009/037941 WO 20090326
- Main IPC: B65B69/00
- IPC: B65B69/00 ; B65G61/00 ; B65H1/00 ; C23C16/00 ; G03C5/00 ; G06F7/00 ; G06F19/00 ; H01L21/677
Abstract:
After a cassette is mounted on a cassette mounting part, a control unit instructs a substrate treatment apparatus to start treatment on substrates in the cassette. Thereafter, the control unit indicates, to the substrate treatment apparatus, a cassette on the cassette mounting part to which a substrate is transferred at completion of the treatment. If the transfer destination cassette for the substrate at the completion of treatment has not been indicated when a number of remaining treatment steps for the substrate reaches a predetermined set number, an alarm is given from the substrate treatment apparatus. This alarm is sent from the substrate treatment apparatus to the control unit, and the control unit indicates a transfer destination cassette for the substrate.
Public/Granted literature
- US20100203434A1 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM Public/Granted day:2010-08-12
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