Invention Grant
- Patent Title: Semiconductor device and its manufacturing method
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13927073Application Date: 2013-06-25
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Publication No.: US08737116B2Publication Date: 2014-05-27
- Inventor: Satoru Hanzawa , Fumihiko Nitta , Nozomu Matsuzaki , Toshihiro Tanaka
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Miles & Stockbridge P.C.
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C13/00

Abstract:
In a semiconductor device including a memory cell array formed of memory cells using a storage element by a variable resistor and a select transistor, a buffer cell is arranged between a sense amplifier and the memory cell array and between a word driver and the memory cell array. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided.
Public/Granted literature
- US20130277635A1 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD Public/Granted day:2013-10-24
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